Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6861034 | Priming mechanisms for drop ejection devices | Scott A. Elrod, Joy Roy, Babur B. Hadimioglu, Richard H. Bruce, Jaan Noolandi | 2005-03-01 |
| 6740530 | Testing method and configurations for multi-ejector system | Richard H. Bruce, Scott A. Elrod, Jaan Noolandi, Babur B. Hadimioglu | 2004-05-25 |
| 6713022 | Devices for biofluid drop ejection | Jaan Noolandi, Babur B. Hadimioglu, Richard H. Bruce, Joy Roy, Scott A. Elrod | 2004-03-30 |
| 6623700 | Level sense and control system for biofluid drop ejection devices | Babur B. Hadimioglu, Richard H. Bruce, Jaan Noolandi, Scott A. Elrod | 2003-09-23 |
| 6514704 | Quality control mechanism and process for a biofluid multi-ejector system | Richard H. Bruce, Scott A. Elrod, Babur B. Hadimioglu, Jaan Noolandi, Joy Roy +1 more | 2003-02-04 |
| 6503454 | Multi-ejector system for ejecting biofluids | Babur B. Hadimioglu, Scott A. Elrod, Richard H. Bruce, Jaan Noolandi | 2003-01-07 |
| 6350405 | Apparatus for manufacturing three dimensional parts using an inert gas | — | 2002-02-26 |
| 6248151 | Method of manufacturing three dimensional parts using an inert gas | — | 2001-06-19 |
| 6168971 | Method of assembling thin film jumper connectors to a substrate | David G. Love, Patricia R. Boucher | 2001-01-02 |
| 6034332 | Power supply distribution structure for integrated circuit chip modules | Larry L. Moresco, Richard L. Wheeler, Solomon I. Beilin | 2000-03-07 |
| 6019814 | Method of manufacturing 3D parts using a sacrificial material | — | 2000-02-01 |
| 6007183 | Acoustic metal jet fabrication using an inert gas | — | 1999-12-28 |
| 5930890 | Structure and fabrication procedure for a stable post | William T. Chou, Solomon I. Beilin, David Kudzuma, Michael G. Lee, Larry L. Moresco +1 more | 1999-08-03 |
| 5773889 | Wire interconnect structures for connecting an integrated circuit to a substrate | David G. Love, Larry L. Moresco, William T. Chou, Connie M. Wong, Solomon I. Beilin | 1998-06-30 |
| 5765279 | Methods of manufacturing power supply distribution structures for multichip modules | Larry L. Moresco, Richard L. Wheeler, Solomon I. Beilin | 1998-06-16 |
| 5722162 | Fabrication procedure for a stable post | William T. Chou, Solomon I. Beilin, David Kudzuma, Michael G. Lee, Larry L. Moresco +1 more | 1998-03-03 |
| 5655290 | Method for making a three-dimensional multichip module | Larry L. Moresco, Wen-chou Vincent Wang | 1997-08-12 |
| 5603892 | System for maintaining a controlled atmosphere in an electronic circuit package | Carlo Grilletto | 1997-02-18 |
| 5536362 | Wire interconnect structures for connecting an integrated circuit to a substrate | David G. Love, Larry L. Moresco, William T. Chou, Connie M. Wong, Solomon I. Beilin | 1996-07-16 |
| 5515604 | Methods for making high-density/long-via laminated connectors | David G. Love | 1996-05-14 |
| 5514906 | Apparatus for cooling semiconductor chips in multichip modules | David G. Love, Larry L. Moresco, Wen-chou Vincent Wang, Richard L. Wheeler, Patricia R. Boucher +1 more | 1996-05-07 |
| 5426563 | Three-dimensional multichip module | Larry L. Moresco, Wen-chou Vincent Wang | 1995-06-20 |
| 5374196 | High-density/long-via laminated connector | — | 1994-12-20 |
| 5334804 | Wire interconnect structures for connecting an integrated circuit to a substrate | David G. Love, Larry L. Moresco, William T. Chou, Connie M. Wong, Solomon I. Beilin | 1994-08-02 |