Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6780092 | Polishing tool used for CMP | — | 2004-08-24 |
| 6461226 | Chemical mechanical polishing of a metal layer using a composite polishing pad | — | 2002-10-08 |
| 6432728 | Method for integration optimization by chemical mechanical planarization end-pointing technique | Shuo Yen Tai, Ming-Cheng Yang, Jiun-Fang Wang | 2002-08-13 |
| 6238279 | Magnetic filtration for slurry used in chemical mechanical polishing of semiconductor wafers | Feng-Yeu Shau, Rurng-Chien Chang | 2001-05-29 |
| 6227949 | Two-slurry CMP polishing with different particle size abrasives | Rurng-Chien Chang, Jiun-Fang Wang | 2001-05-08 |
| 6153116 | Method of detecting end point and monitoring uniformity in chemical-mechanical polishing operation | Ming-Cheng Yang, Feng-Yeu Shau, Cheng-Sung Huang | 2000-11-28 |
| 6146260 | Polishing machine | — | 2000-11-14 |
| 6130163 | Stabilization of slurry used in chemical mechanical polishing of semiconductor wafers by adjustment of PH of deionized water | Ching-Feng Tsai, Jiun-Fang Wang | 2000-10-10 |
| 6053802 | Stabilization of slurry used in chemical mechanical polishing of semiconductor wafers by megasonic pulse | Jen-Chieh Tung, Jiun-Fang Wang | 2000-04-25 |
| 5776833 | Method for forming metal plug | Hsi-Chieh Chen, Pei-Jan Wang, Yeong-Ruey Shiue | 1998-07-07 |