Issued Patents All Time
Showing 1–25 of 118 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315783 | Integrated circuit with a ring-shaped hot spot area and multidirectional cooling | Madhusudan K. Iyengar, Norman Paul Jouppi, Jorge Padilla | 2025-05-27 |
| 12243802 | Methods and heat distribution devices for thermal management of chip assemblies | Madhusudan K. Iyengar, Woon-Seong Kwon, Emad Samadiani, Melanie Beauchemin, Padam Jain +6 more | 2025-03-04 |
| 12156365 | Powering electronic devices in a data center | Varun Sakalkar, Jyoti Sastry, James Kennedy, Eduardo Lao, Pascal Kam | 2024-11-26 |
| 12145850 | Producing carbon dioxide with waste heat | Bryan Christopher GilroySmith, Jacques Gagne, Robert Russell Nelson | 2024-11-19 |
| 11990386 | Methods and heat distribution devices for thermal management of chip assemblies | Madhusudan K. Iyengar, Woon-Seong Kwon, Emad Samadiani, Melanie Beauchemin, Padam Jain +6 more | 2024-05-21 |
| 11895807 | Thermal management of battery units on data center racks | Madhusudan K. Iyengar, Melanie Beauchemin | 2024-02-06 |
| 11832396 | Cooling electronic devices in a data center | Madhusudan K. Iyengar, Yuan Li, Jorge Padilla, Woon-Seong Kwon, Teckgyu Kang +1 more | 2023-11-28 |
| 11685658 | Producing carbon dioxide with waste heat | Bryan Christopher GilroySmith, Jacques Gagne, Robert Russell Nelson | 2023-06-27 |
| 11503735 | Powering electronic devices in a data center | Varun Sakalkar, Jyoti Sastry, James Kennedy, Eduardo Lao, Pascal Kam | 2022-11-15 |
| 11348859 | Thermoelectric cooler (TEC) for spot cooling of 2.5D/3D IC packages | Melanie Beauchemin, Madhusudan K. Iyengar, Gregory P. Imwalle | 2022-05-31 |
| 11303120 | Modular direct current (DC) architectures | Eduardo Lao, Jyoti Sastry, James Kennedy, Varun Sakalkar | 2022-04-12 |
| 11303121 | Modular direct current (DC) architectures | Eduardo Lao, Jyoti Sastry, James Kennedy, Varun Sakalkar | 2022-04-12 |
| 11287863 | Fuel cell power management | James Kennedy | 2022-03-29 |
| 11240938 | Evaporative induction cooling system for a data center | Andrew B. Carlson, Jimmy Clidaras | 2022-02-01 |
| 11158566 | Integrated circuit with a ring-shaped hot spot area and multidirectional cooling | Madhusudan K. Iyengar, Norman Paul Jouppi, Jorge Padilla | 2021-10-26 |
| 11146099 | Two-tier battery solution for data center backup | — | 2021-10-12 |
| 10888030 | Managing dependencies between data center computing and infrastructure | Thomas R. Kowalski, Ankit Somani | 2021-01-05 |
| 10721844 | Managing dependencies between data center computing and infrastructure | Thomas R. Kowalski, Ankit Somani | 2020-07-21 |
| 10716236 | Cooling a data center | Thomas R. Kowalski | 2020-07-14 |
| 10681846 | Cooling electronic devices in a data center | Madhusudan K. Iyengar, Yuan Li, Jorge Padilla, Woon-Seong Kwon, Teckgyu Kang +1 more | 2020-06-09 |
| 10587115 | Modular direct current (DC) architectures | Eduardo Lao, Jyoti Sastry, James Kennedy, Varun Sakalkar | 2020-03-10 |
| 10559972 | Two-tier battery solution for data center backup | — | 2020-02-11 |
| 10548240 | Cooling electronic devices in a data center | Madhusudan K. Iyengar, Yuan Li, Jorge Padilla, Woon-Seong Kwon, Teckgyu Kang +1 more | 2020-01-28 |
| 10504816 | Thermoelectric cooler (TEC) for spot cooling of 2.5D/3D IC packages | Melanie Beauchemin, Madhusudan K. Iyengar, Gregory P. Imwalle | 2019-12-10 |
| 10492329 | Powering electronic devices in a data center | Varun Sakalkar, Jyoti Sastry, James Kennedy, Eduardo Lao, Pascal Kam | 2019-11-26 |