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Manufacturing method of package structure |
Kai-Ming Yang, Cheng-Ta Ko, John Hon-Shing Lau, Yu-Hua Chen, Tzyy-Jang Tseng |
2025-09-09 |
| 11943877 |
Circuit board structure and manufacturing method thereof |
Wen-Yu Lin, Kai-Ming Yang, Pu-Ju Lin, Cheng-Ta Ko, Chin-Sheng Wang +2 more |
2024-03-26 |
| 11895780 |
Manufacturing method of package structure |
Kai-Ming Yang, Wang-Hsiang Tsai, Cheng-Ta Ko |
2024-02-06 |
| 11682658 |
Light-emitting package and method of manufacturing the same |
Kai-Ming Yang, Chia-Hao Chang, Tzu-Nien LEE |
2023-06-20 |
| 11523503 |
Wiring board and method of forming hole thereof |
Kai-Ming Yang, Bo-Cheng Lin |
2022-12-06 |
| 11445617 |
Package structure and manufacturing method thereof |
Kai-Ming Yang, Cheng-Ta Ko, John Hon-Shing Lau, Yu-Hua Chen, Tzyy-Jang Tseng |
2022-09-13 |
| 11219130 |
Circuit board and manufacturing method thereof |
Kai-Ming Yang |
2022-01-04 |
| 11166387 |
Wiring board and manufacturing method thereof |
Kai-Ming Yang, Pu-Ju Lin |
2021-11-02 |
| 10993332 |
Circuit substrate |
Kai-Ming Yang |
2021-04-27 |