CK

Chan Hoon Ko

SC Stats Chippac: 6 patents #121 of 425Top 30%
Samsung: 5 patents #22,466 of 75,807Top 30%
Overall (All Time): #432,482 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12256492 Printed circuit board Ki Hee Cho, Sang Hoon Kim 2025-03-18
12224235 Printed circuit board Sang Hoon Kim, Yoong Oh, Hea Sung Kim 2025-02-11
11735510 Printed circuit board and electronic component package 2023-08-22
11729910 Printed circuit board and electronic component package 2023-08-15
11722756 Camera module with droplet removing device Won-kyu Jang, Hee Sung JUN 2023-08-08
8906740 Integrated circuit packaging system having dual sided connection and method of manufacture thereof Soo-San Park, YoungChul Kim 2014-12-09
8535981 Integrated circuit package-on-package system with underfilling structures and method of manufacture thereof SeungYun Ahn 2013-09-17
8067828 System for solder ball inner stacking module connection Soo-San Park 2011-11-29
8004073 Integrated circuit packaging system with interposer and method of manufacture thereof Soo-San Park 2011-08-23
7968995 Integrated circuit packaging system with package-on-package and method of manufacture thereof Soo-San Park, HeeJo Chi 2011-06-28
7923290 Integrated circuit packaging system having dual sided connection and method of manufacture thereof Soo-San Park, YoungChul Kim 2011-04-12