Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374558 | Laser-assisted bonding apparatus for bonding an electronic device to a substrate | Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu | 2025-07-29 |
| 11749637 | Hybrid bonding interconnection using laser and thermal compression | Min Ho Kim, Seok Ho Na, Dong Hyeon Park, Woo Kyung Ju, Yun Seok Song +1 more | 2023-09-05 |
| 11742216 | System and method for laser assisted bonding of an electronic device | Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu | 2023-08-29 |
| 10763129 | System and method for laser assisted bonding of an electronic device | Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu | 2020-09-01 |
| 10304698 | System and method for laser assisted bonding of semiconductor die | Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu | 2019-05-28 |
| 9916989 | System and method for laser assisted bonding of semiconductor die | Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu | 2018-03-13 |
| 9627348 | Laser assisted bonding for semiconductor die interconnections | Dong Su Ryu, Choon Heung Lee, Min Ho Kim, Ju Hoon Yoon, Chan Ha Hwang +1 more | 2017-04-18 |