| 12117893 |
Error documentation assistance |
Javier Lozano, William Luo, Bing (Aaron) Lin |
2024-10-15 |
| 11693726 |
Error documentation assistance |
Javier Lozano, William Luo, Bing (Aaron) Lin |
2023-07-04 |
| D768350 |
Cash storing apparatus |
— |
2016-10-04 |
| D726813 |
Cash count audit apparatus |
— |
2015-04-14 |
| 8666941 |
System and method for persistent storage of common user information for interactive television using a centrally located repository |
Steven Soloff, Edward P. Jurado |
2014-03-04 |
| 8138916 |
Counterfeit detection system and method of utilizing same |
— |
2012-03-20 |
| 7844994 |
System and method for persistent storage of common user information for interactive television using a centrally located repository |
Steven Soloff, Edward P. Jurado |
2010-11-30 |
| 7793324 |
System for obtaining data regarding customer use of interactive television |
Derek P. Footer, Angela M. Trujillo, Narda J. Laverde |
2010-09-07 |
| 7498678 |
Electronic assemblies and systems with filled no-flow underfill |
Song Shi, Milan Djukic |
2009-03-03 |
| 7323360 |
Electronic assemblies with filled no-flow underfill |
Song Shi, Milan Djukic |
2008-01-29 |
| 7235886 |
Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby |
Biju Chandran |
2007-06-26 |
| 7199342 |
Self-aligned mechanical joint between die and substrate exposed to mixed microwave energy |
Glenn Ratificar, Lejun Wang |
2007-04-03 |
| 7122403 |
Method of interconnecting die and substrate |
Biju Chandran |
2006-10-17 |
| 7096580 |
I/C package/thermal-solution retention mechanism with spring effect |
Leo Ofman |
2006-08-29 |
| 6884943 |
I/C package/ thermal-solution retention mechanism with spring effect |
Leo Ofman |
2005-04-26 |
| 6752634 |
Contact array for semiconductor package |
Biju Chandran |
2004-06-22 |
| 6750551 |
Direct BGA attachment without solder reflow |
Kristopher Frutschy, Charles A. Gealer |
2004-06-15 |
| 6750549 |
Variable pad diameter on the land side for improving the co-planarity of ball grid array packages |
Biju Chandran |
2004-06-15 |
| 6672892 |
Package retention module coupled directly to a socket |
Biju Chandran |
2004-01-06 |
| 6657131 |
I/C package / thermal-solution retention mechanism with spring effect |
Leo Ofman |
2003-12-02 |
| 6644536 |
Solder reflow with microwave energy |
Glenn Ratificar, Lejun Wang |
2003-11-11 |
| 6600652 |
Package retention module coupled directly to a socket |
Biju Chandran |
2003-07-29 |
| 5771056 |
Digital image reproduction system including a programmable sorter |
Steven Cook |
1998-06-23 |
