Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8716849 | Semiconductor device including one or more stiffening elements | Chad A. Cobbley | 2014-05-06 |
| 8508034 | Electronic devices | Todd O. Bolken, Steven W. Heppler, Chad A. Cobbley | 2013-08-13 |
| 8148803 | Molded stiffener for thin substrates | Chad A. Cobbley | 2012-04-03 |
| 8115296 | Electronic device package | Todd O. Bolken, Steven W. Heppler, Chad A. Cobbley | 2012-02-14 |
| 8093730 | Underfilled semiconductor die assemblies and methods of forming the same | Frank Hall | 2012-01-10 |
| 7851907 | Semiconductor integrated circuit package having electrically disconnected solder balls for mounting | Frank Hall | 2010-12-14 |
| 7468559 | Semiconductor integrated circuit package having electrically disconnected solder balls for mounting | Frank Hall | 2008-12-23 |
| 7459773 | Stackable ball grid array | Todd O. Bolken, Chad A. Cobbley, David J. Corisis | 2008-12-02 |
| 7423331 | Molded stiffener for thin substrates | Chad A. Cobbley | 2008-09-09 |
| 7344921 | Integrated circuit device having reduced bow and method for making same | William Tandy, Matt E. Schwab | 2008-03-18 |
| 7342319 | Semiconductor integrated circuit package having electrically disconnected solder balls for mounting | Frank Hall | 2008-03-11 |
| 7288431 | Molded stiffener for thin substrates | Chad A. Cobbley | 2007-10-30 |
| 7276802 | Semiconductor integrated circuit package having electrically disconnected solder balls for mounting | Frank Hall | 2007-10-02 |
| 7268067 | Semiconductor integrated circuit package having electrically disconnected solder balls for mounting | Frank Hall | 2007-09-11 |
| 7262074 | Methods of fabricating underfilled, encapsulated semiconductor die assemblies | Frank Hall | 2007-08-28 |
| 7239029 | Packages for semiconductor die | Todd O. Bolken, David J. Corisis, Chad A. Cobbley | 2007-07-03 |
| 7144245 | Packages for semiconductor die | Todd O. Bolken, David J. Corisis, Chad A. Cobbley | 2006-12-05 |
| 7116000 | Underfilled, encapsulated semiconductor die assemblies and methods of fabrication | Frank Hall | 2006-10-03 |
| 7101730 | Method of manufacturing a stackable ball grid array | Todd O. Bolken, Chad A. Cobbley, David J. Corisis | 2006-09-05 |
| 7095097 | Integrated circuit device having reduced bow and method for making same | William Tandy, Matt E. Schwab | 2006-08-22 |
| 7091060 | Circuit and substrate encapsulation methods | Todd O. Bolken, David J. Corisis, Chad A. Cobbley | 2006-08-15 |
| 7026548 | Moisture-resistant electronic device package and methods of assembly | Todd O. Bolken, Steven W. Heppler, Chad A. Cobbley | 2006-04-11 |
| 7019408 | Stackable ball grid array | Todd O. Bolken, Chad A. Cobbley, David J. Corisis | 2006-03-28 |
| 6953891 | Moisture-resistant electronic device package and methods of assembly | Todd O. Bolken, Steven W. Heppler, Chad A. Cobbley | 2005-10-11 |
| 6887740 | Method for making an integrated circuit package having reduced bow | William Tandy, Matt E. Schwab | 2005-05-03 |