Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11948877 | Hybrid package apparatus and method of fabricating | Aniket PATIL, Hong Bok We | 2024-04-02 |
| 11581262 | Package comprising a die and die side redistribution layers (RDL) | Aniket PATIL, Hong Bok We, Yuzhe ZHANG | 2023-02-14 |
| 11552023 | Passive component embedded in an embedded trace substrate (ETS) | Kuiwon Kang, Marcus HSU, Terence Cheung | 2023-01-10 |
| 11177223 | Electromagnetic interference shielding for packages and modules | Aniket PATIL, Hong Bok We | 2021-11-16 |
| 10804195 | High density embedded interconnects in substrate | Kuiwon Kang, Marcus HSU, Houssam Jomaa | 2020-10-13 |