Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10199516 | Method for fabricating a photovoltaic device by uniform plating on dielectric passivated through-wafer vias and interconnects | Shu-Yun Chong, John M. Cotte, Ronald D. Goldblatt, Jeffrey Hedrick, Qiang Huang +4 more | 2019-02-05 |
| 9911648 | Interconnects based on subtractive etching of silver | Eric A. Joseph, Hiroyuki Miyazoe | 2018-03-06 |
| 9716192 | Method for fabricating a photovoltaic device by uniform plating on emitter-lined through-wafer vias and interconnects | Shu-Yun Chong, John M. Cotte, Ronald D. Goldblatt, Jeffrey Hedrick, Qiang Huang +4 more | 2017-07-25 |
| 9564362 | Interconnects based on subtractive etching of silver | Eric A. Joseph, Hiroyuki Miyazoe | 2017-02-07 |
| 8901414 | Photovoltaic cells with copper grid | Qiang Huang | 2014-12-02 |
| 8008199 | Microstructure modification in copper interconnect structure | Cyril Cabral, Jr., Qiang Huang, Kenneth P. Rodbell | 2011-08-30 |
| 7843063 | Microstructure modification in copper interconnect structure | Cyril Cabral, Jr., Qiang Huang, Kenneth P. Rodbell | 2010-11-30 |
| 7736474 | Plating apparatus and plating method | Keiichi Kurashina, Mizuki Nagai, Satoru Yamamoto, Hiroyuki Kanda, Koji Mishima +7 more | 2010-06-15 |
| 7479213 | Plating method and plating apparatus | Mizuki Nagai, Hiroyuki Kanda, Keiichi Kurashina, Satoru Yamamoto, Hidenao Suzuki +3 more | 2009-01-20 |