Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7553400 | Plating apparatus and plating method | Mizuki Nagai, Hiroyuki Kanda, Keiichi Kurashina, Satoru Yamamoto, Ryoichi Kimizuka +4 more | 2009-06-30 |
| 7311809 | Plating apparatus for substrate | Keiichi Kurashina, Mizuki Nagai, Satoru Yamamoto, Hiroyuki Kanda, Koji Mishima +2 more | 2007-12-25 |
| 6297155 | Method for forming a copper layer over a semiconductor wafer | Cindy Reidsema Simpson, Robert D. Mikkola, Matthew T. Herrick, David Moralez Pena, Edward Acosta +4 more | 2001-10-02 |