Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8490573 | Method and apparatus for material deposition | Yezdi Dordi, John M. Boyd, William Thie, Fred C. Redeker, Joel M. Cook | 2013-07-23 |
| 8419917 | Electroplating head and method for operating the same | Yezdi Dordi, John M. Boyd, Fred C. Redeker | 2013-04-16 |
| 8048283 | Method and apparatus for plating semiconductor wafers | Yezdi Dordi, John M. Boyd, Fred C. Redeker, Carl Woods | 2011-11-01 |
| 7875554 | Method for electroless depositing a material on a surface of a wafer | Yezdi Dordi, John M. Boyd, William Thie, Fred C. Redeker, Joel M. Cook | 2011-01-25 |
| 7704367 | Method and apparatus for plating semiconductor wafers | Yezdi Dordi, John M. Boyd, Fred C. Redeker, Carl Woods | 2010-04-27 |
| 7582565 | Method and apparatus for semiconductor wafer planarization | Fred C. Redeker, John M. Boyd, Yezdi Dordi, William Thie | 2009-09-01 |
| 7563348 | Electroplating head and method for operating the same | Yezdi Dordi, John M. Boyd, Fred C. Redeker | 2009-07-21 |
| 7368017 | Method and apparatus for semiconductor wafer planarization | Fred C. Redeker, John M. Boyd, Yezdi Dordi, William Thie | 2008-05-06 |
| 7358186 | Method and apparatus for material deposition in semiconductor fabrication | Yezdi Dordi, John M. Boyd, William Thie, Fred C. Redeker, Joel M. Cook | 2008-04-15 |