Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9443956 | Method for forming air gap structure using carbon-containing spacer | Hong Yu, Jin Ping Liu, Huang Liu | 2016-09-13 |
| 7838390 | Methods of forming integrated circuit devices having ion-cured electrically insulating layers therein | Jun Jung Kim, Joo-chan Kim, Jae-eon Park, Richard A. Conti, Zhao Lun +2 more | 2010-11-23 |