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Method for reworking a multi-layer circuit board using a shape memory alloy material |
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1999-07-20 |
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Repairable flip-chip undercoating assembly and method and material for same |
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1998-07-21 |
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Ultrasonic flip chip bonding process and apparatus |
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1997-09-23 |
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Ultrasonic flip chip bonding process and apparatus |
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1997-08-12 |
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Method and apparatus for testing an integrated circuit using controlled wirebonding and wirebonding removal |
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Method and adjustment for known good die testing using resilient conductive straps |
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Ultrasonic flip chip process and apparatus |
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