Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191346 | Selective area metal process for improved metallurgical bonding of aluminum to copper for integrated passive devices in a semiconductor device | Jose F. Solis Camara, Ryan Wong | 2025-01-07 |
| 12183692 | Embedded inductors and integrated voltage regulators for packaged semiconductor devices | Carlos Riera, Urmi Ray | 2024-12-31 |
| 11955424 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2024-04-09 |
| 11574864 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2023-02-07 |
| 11056429 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2021-07-06 |
| 10912986 | Dynamic rigidity mechanism | Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo | 2021-02-09 |
| 10784156 | Self-aligned airgaps with conductive lines and vias | Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2020-09-22 |
| 10770348 | Location-specific laser annealing to improve interconnect microstructure | Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo | 2020-09-08 |
| 10752039 | Structure of implementing a directed self-assembled security pattern | Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo | 2020-08-25 |
| 10629529 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2020-04-21 |
| 10559498 | Location-specific laser annealing to improve interconnect microstructure | Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo | 2020-02-11 |
| 10515894 | Enhanced self-alignment of vias for a semiconductor device | Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo, Nicole Saulnier | 2019-12-24 |
| 10366920 | Location-specific laser annealing to improve interconnect microstructure | Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo | 2019-07-30 |
| 10366952 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2019-07-30 |
| 10315451 | Structure, system, method, and recording medium of implementing a directed self-assembled security pattern | Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo | 2019-06-11 |
| 10229967 | High-density MIM capacitors | Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2019-03-12 |
| 10211151 | Enhanced self-alignment of vias for asemiconductor device | Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo, Nicole Saulnier | 2019-02-19 |
| 10150323 | Structure, system, method, and recording medium of implementing a directed self-assembled security pattern | Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo | 2018-12-11 |
| 10109579 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2018-10-23 |
| 10099108 | Dynamic rigidity mechanism | Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo | 2018-10-16 |
| 10083905 | Skip-vias bypassing a metallization level at minimum pitch | Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2018-09-25 |
| 9997451 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2018-06-12 |
| 9911651 | Skip-vias bypassing a metallization level at minimum pitch | Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2018-03-06 |
| 9899256 | Self-aligned airgaps with conductive lines and vias | Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2018-02-20 |
| 9899338 | Structure and fabrication method for enhanced mechanical strength crack stop | Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2018-02-20 |