Issued Patents All Time
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5773198 | Method of forming high resolution circuitry by depositing a polyvinyl alcohol layer beneath a photosensitive polymer layer | Thomas J. Swirbel, Joaquin Barreto | 1998-06-30 |
| 5771004 | Gas detection system for a portable communication | Anthony J. Suppelsa, Michael F. Shaw | 1998-06-23 |
| 5740066 | Electrical circuit board and circuit board assembly | Anthony J. Suppelsa, Henry F. Liebman, John Marvin Cook, II | 1998-04-14 |
| 5686226 | Method of forming an applicator for applying tacking media to a circuit substrate | Barry B. Groman, Scott G. Potter | 1997-11-11 |
| 5637834 | Multilayer circuit substrate and method for forming same | Frank J. La Bate, Jr., John A. De Santis | 1997-06-10 |
| 5591364 | Housing with integral opening feature | Dale W. Dorinski | 1997-01-07 |
| 5573859 | Auto-regulating solder composition | — | 1996-11-12 |
| 5542171 | Method of selectively releasing plastic molding material from a surface | Frank J. Juskey, Fadia Nounou | 1996-08-06 |
| 5536917 | Housing with integral thin film resistive snap-fits | Dale W. Dorinski | 1996-07-16 |
| 5455446 | Leaded semiconductor package having temperature controlled lead length | Robert Francis Darveaux, Michael L. Weiss | 1995-10-03 |
| 5438216 | Light erasable multichip module | Frank J. Juskey, Dale W. Dorinski | 1995-08-01 |
| 5421083 | Method of manufacturing a circuit carrying substrate having coaxial via holes | Anthony J. Suppelsa, Fadia Nounou | 1995-06-06 |
| 5379186 | Encapsulated electronic component having a heat diffusing layer | Glenn E. Gold, Anthony J. Suppelsa | 1995-01-03 |
| 5373276 | Self centering coil | Anthony J. Suppelsa, Fadia Nounou | 1994-12-13 |
| 5371404 | Thermally conductive integrated circuit package with radio frequency shielding | Frank J. Juskey | 1994-12-06 |
| 5338391 | Method of making a substrate having selectively releasing conductive runners | William B. Mullen, III, Glenn F. Urbish | 1994-08-16 |
| 5300808 | EPROM package and method of optically erasing | Anthony J. Suppelsa, Lynne J. Giacomino, Dale W. Dorinski | 1994-04-05 |
| 5280139 | Selectively releasing conductive runner and substrate assembly | William B. Mullen, III, Glenn F. Urbish | 1994-01-18 |
| 5264061 | Method of forming a three-dimensional printed circuit assembly | Frank J. Juskey, Dale W. Dorinski | 1993-11-23 |
| 5255839 | Method for solder application and reflow | Francisco da Costa Alves, Kenneth R. Thompson | 1993-10-26 |
| 5232758 | Non-hardening solvent removable hydrophobic conformal coatings | Frank J. Juskey, Kenneth M. Wasko | 1993-08-03 |
| 5218759 | Method of making a transfer molded semiconductor device | Frank J. Juskey, Lonnie L. Bernardoni, Bruce J. Freyman | 1993-06-15 |
| 5177669 | Molded ring integrated circuit package | Frank J. Juskey, Linda K. Berrian | 1993-01-05 |
| 5176773 | Method of manufacturing a ceramic carrier | Kenneth R. Thompson | 1993-01-05 |
| 5177134 | Tacking agent | William B. Mullen, III, Robert W. Pennisi | 1993-01-05 |