| 11476389 |
Method for producing an optoelectronic semiconductor chip having structures at the radiation passage surface, and optoelectronic semiconductor chip having structures at the radiation passage surface |
Michael Huber, Jana Sommerfeld, Martin Herz, Sebastian Hoibl, Christian Rumbolz +3 more |
2022-10-18 |
| 9825198 |
Method of producing a plurality of optoelectronic semiconductor chips, and optoelectronic semiconductor chip |
Patrick Rode, Lutz Hoeppel, Norwin von Malm, Stefan Illek, Siegfried Herrmann |
2017-11-21 |
| 7259060 |
Method for fabricating a semiconductor structure |
Jurgen Amon, Jurgen Faul, Johann Alsmeier, Matthias Goldbach, Ralf Müller +2 more |
2007-08-21 |
| 7217610 |
Method for fabricating a semiconductor product with a memory area and a logic area |
Werner Graf |
2007-05-15 |
| 7189614 |
Method for fabricating a trench structure which is electrically connected to a substrate on one side via a buried contact |
Stephan Kudelka, Kevin Pears |
2007-03-13 |
| 6864170 |
Compact semiconductor structure |
Falko Höhnsdorf, Detlef Weber |
2005-03-08 |
| 6849364 |
Mask for fabricating semiconductor components |
Hermann Sachse |
2005-02-01 |
| 6753236 |
Method for planarizing an isolating layer |
Klaus Feldner, Werner Graf, Hermann Sachse |
2004-06-22 |
| 6750112 |
Method of forming a bitline and a bitline contact, and dynamic memory cell including a bitline and bitline made contact according to the method |
— |
2004-06-15 |
| 6737748 |
Stacked via with specially designed landing pad for integrated semiconductor structures |
Lothar Bauch, Thomas Zell, Matthias Lehr |
2004-05-18 |
| 6638814 |
Method for producing an insulation |
Klaus Feldner, Herbert Benzinger |
2003-10-28 |
| 6559547 |
Patterning of content areas in multilayer metalization configurations of semiconductor components |
Matthias Lehr, Peter Thieme, Lars Voland |
2003-05-06 |
| 6368940 |
Method for fabricating a microelectronic structure |
Jurgen Amon |
2002-04-09 |
