Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6864423 | Bump chip lead frame and package | Chong Un Tan, Chee Chuan Chew | 2005-03-08 |
| 6392288 | Lead frame for assembly for thin small outline plastic encapsulated packages | Chee Hiong CHEW, Shan Chong Tan | 2002-05-21 |
| 6376266 | Semiconductor package and method for forming same | James P. Letterman, Jr., Kenneth Teik Kheong Low, Saat Shukri Embong, Chee Hiong CHEW, Boon Huat Lim +4 more | 2002-04-23 |