Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8242378 | Soldering method and related device for improved resistance to brittle fracture with an intermetallic compound region coupling a solder mass to an Ni layer which has a low concentration of P, wherein the amount of P in the underlying Ni layer is controlled as a function of the expected volume of the solder mass | Frank Baiocchi, John M. DeLucca, John W. Osenbach, Brian T. Vaccaro | 2012-08-14 |
| 7982307 | Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate | David Crouthamel, John W. Osenbach, Thomas H. Shilling, Brian T. Vaccaro | 2011-07-19 |
| 7724359 | Method of making electronic entities | Mark A. Bachman, Frank Baiocchi, John M. DeLucca, John W. Osenbach | 2010-05-25 |
| 7671436 | Electronic packages | Mark A. Bachman, David Crouthamel, John W. Osenbach, Brian T. Vaccaro | 2010-03-02 |