Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11884859 | Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topography | Matthias Stender, Bradley J. Brennan | 2024-01-30 |
| 11401441 | Chemical mechanical planarization (CMP) composition and methods therefore for copper and through silica via (TSV) applications | Xiaobo Shi, Laura M. Matz, Chris Keh-Yeuan Li, Ming-Shih Tsai, Pao-Chia Pan +4 more | 2022-08-02 |
| 11111435 | Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topography | Matthias Stender, Bradley J. Brennan | 2021-09-07 |