KH

Kieran P. Harney

IN Invensense: 26 patents #12 of 391Top 4%
AD Analog Devices: 16 patents #68 of 1,943Top 4%
📍 Andover, MA: #36 of 1,295 inventorsTop 3%
🗺 Massachusetts: #1,705 of 88,656 inventorsTop 2%
Overall (All Time): #72,784 of 4,157,543Top 2%
42
Patents All Time

Issued Patents All Time

Showing 26–42 of 42 patents

Patent #TitleCo-InventorsDate
8767982 Microphone module with sound pipe Dipak Sengupta, Brian Moss, Alain Valentin Guery 2014-07-01
8477983 Multi-microphone system Jason W. Weigold 2013-07-02
8351632 Noise mitigating microphone system and method Jason W. Weigold, Gary W. Elko 2013-01-08
8270634 Multiple microphone system Jason W. Weigold, Gary W. Elko 2012-09-18
8223981 Wide dynamic range microphone Olli Haila, Gary W. Elko 2012-07-17
8130979 Noise mitigating microphone system and method Jason W. Weigold, Gary W. Elko 2012-03-06
8111871 Microphone with pressure relief Xin Zhang, Michael Judy, Jason W. Weigold 2012-02-07
7928584 Stacked MEMS device Liam O Suilleabhain, Raymond Goggin, Eva Murphy 2011-04-19
7642657 Stacked MEMS device Liam O Suilleabhain, Raymond Goggin, Eva Murphy 2010-01-05
7357017 Wafer level capped sensor Lawrence E. Felton, Carl M. Roberts, Jr. 2008-04-15
7040922 Multi-surface mounting member and electronic device Lawrence E. Felton, Lewis Long 2006-05-09
6946326 Method and device for protecting micro electromechanical systems structures during dicing of a wafer Timothy Spooner, David S. Courage, John R. Martin 2005-09-20
6936918 MEMS device with conductive path through substrate Lawrence E. Felton, Thomas Kieran Nunan, Susan A. Alie, Bruce Wachtmann 2005-08-30
6931170 Fiber-attached optical devices with in-plane micromachined mirrors Chang-Han Yun, Shanti Bhattacharya, Yakov Reznichenko, John R. Martin, Lawrence E. Felton +2 more 2005-08-16
6825744 Active alignment as an integral part of optical package design 2004-11-30
6768196 Packaged microchip with isolation Lewis Long 2004-07-27
6555417 Method and device for protecting micro electromechanical system structures during dicing of a wafer Timothy Spooner 2003-04-29