Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11528809 | Method for orienting solder balls on a BGA device | Scott Gilbert | 2022-12-13 |
| 11500412 | Techniques for clock signal transmission in integrated circuits and interposers | Jeffrey Christopher Chromczak, Chooi Pei Lim, Lai Guan Tang, Chee Hak Teh, Dheeraj Subbareddy +1 more | 2022-11-15 |
| 11476185 | Innovative way to design silicon to overcome reticle limit | Dinesh Somasekhar, Dheeraj Subbareddy | 2022-10-18 |
| 11342238 | Rotatable architecture for multi-chip package (MCP) | Ankireddy Nalamalpu, Dheeraj Subbareddy | 2022-05-24 |
| 11216397 | Translation circuitry for an interconnection in an active interposer of a semiconductor package | Lai Guan Tang, Ankireddy Nalamalpu, Dheeraj Subbareddy, Chee Hak Teh | 2022-01-04 |
| 11121109 | Innovative interconnect design for package architecture to improve latency | Ankireddy Nalamalpu, Dheeraj Subbareddy | 2021-09-14 |
| 11080449 | Modular periphery tile for integrated circuit device | Chee Hak Teh, Ankireddy Nalamalpu, Dheeraj Subbareddy, Sean R. Atsatt, Lai Guan Tang | 2021-08-03 |
| 11070209 | Programmable logic device with fine-grained disaggregation | Dheeraj Subbareddy, Ankireddy Nalamalpu, Robert Sankman, Ravindranath V. Mahajan, Gregg William Baeckler | 2021-07-20 |
| 11056452 | Interface bus for inter-die communication in a multi-chip package over high density interconnects | Dheeraj Subbareddy, Ankireddy Nalamalpu | 2021-07-06 |
| 10980134 | Method for orienting solder balls on a BGA device | Scott Gilbert | 2021-04-13 |
| 10950537 | Land side and die side cavities to reduce package z-height | Scott Gilbert | 2021-03-16 |
| 10642946 | Modular periphery tile for integrated circuit device | Chee Hak Teh, Ankireddy Nalamalpu, Dheeraj Subbareddy, Sean R. Atsatt, Lai Guan Tang | 2020-05-05 |
| 10601426 | Programmable logic device with fine-grained disaggregation | Dheeraj Subbareddy, Ankireddy Nalamalpu, Robert Sankman, Ravindranath V. Mahajan, Gregg William Baeckler | 2020-03-24 |
| 10297542 | Land side and die side cavities to reduce package z-height | Scott Gilbert | 2019-05-21 |
| 10278292 | Method for orienting solder balls on a BGA device | Scott Gilbert | 2019-04-30 |
| 9961769 | Microelectronic substrate for alternate package functionality | Cliff C. Lee, David W. Browning, Itai M. Pines, Brian P. Kelly | 2018-05-01 |
| 9940984 | Shared command address (C/A) bus for multiple memory channels | Nagi Aboulenein, Jayapratap Bharathan | 2018-04-10 |
| 9799556 | Land side and die side cavities to reduce package z-height | Scott Gilbert | 2017-10-24 |
| 9721882 | Land side and die side cavities to reduce package z-height | Scott Gilbert | 2017-08-01 |
| 9480162 | Circuit board with integrated passive devices | Jin Zhao, John Vu | 2016-10-25 |
| 9293426 | Land side and die side cavities to reduce package Z-height | Scott Gilbert | 2016-03-22 |
| 9268724 | Configuration of data strobes | Kevin J. Doran, Nagi Aboulenein | 2016-02-23 |
| 9237659 | BGA structure using CTF balls in high stress regions | Scott Gilbert | 2016-01-12 |
| 8683096 | Configuration of data strobes | Kevin J. Doran, Nagi Aboulenein | 2014-03-25 |
| 8674235 | Microelectronic substrate for alternate package functionality | Cliff C. Lee, David W. Browning, Itai M. Pines, Brian P. Kelly | 2014-03-18 |