Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027361 | High temperature superconductor-based interconnect systems with a lowered thermal load for interconnecting cryogenic electronics with non-cryogenic electronics | Dawson Yee, Craig S. Ranta, Douglas P. Kelley, Matthew David Turner, David B. Tuckerman | 2024-07-02 |
| 9961769 | Microelectronic substrate for alternate package functionality | MD Altaf Hossain, David W. Browning, Itai M. Pines, Brian P. Kelly | 2018-05-01 |
| 8674235 | Microelectronic substrate for alternate package functionality | MD Altaf Hossain, David W. Browning, Itai M. Pines, Brian P. Kelly | 2014-03-18 |
| 7356796 | Method and apparatus to boost high-speed I/O signal performance using semi-interleaved transmitter/receiver pairs at silicon die bump and package layout interfaces | Scott T. Gardiner, Jeffrey Krieger, Jen-Tai Hsu, Fei Deng | 2008-04-08 |