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Home › Method and apparatus to boost high-speed I/O signal performance using semi-interleaved transmitter/receiver pairs at silicon die bump and package layout interfaces

Method and apparatus to boost high-speed I/O signal performance using semi-interleaved transmitter/receiver pairs at silicon die bump and package layout interfaces

US Patent 7356796 · Granted Apr 8, 2008

Estimated economic value: $22,423,000 ⓘ

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