Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068296 | Method for wafer bonding and compound semiconductor wafer | Stefan Hampl, Kerstin Kaemmer, Norbert Thyssen | 2024-08-20 |
| 11428661 | Method for producing a moisture sensor at the wafer level and moisture sensor | Heiko Froehlich, Thoralf Kautzsch, Olga Khvostikova, Marten Oldsen, Bernhard Straub | 2022-08-30 |
| 10870575 | Stressed decoupled micro-electro-mechanical system sensor | Horst Theuss, Bernhard Knott, Thoralf Kautzsch, Mirko Vogt, Maik Stegemann +4 more | 2020-12-22 |
| 10386255 | Pressure sensor device and manufacturing method | Thoralf Kautzsch, Heiko Froehlich, Andre Roeth, Maik Stegemann, Mirko Vogt | 2019-08-20 |
| 10329140 | Semiconductor device, pressure sensor, microphone, and acceleration sensor | Henning Feick, Kerstin Kaemmer | 2019-06-25 |