Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6119338 | Method for manufacturing high-density multilayer printed circuit boards | Man-Lin Chen, Chuang-Shin Chiou, Ming-Shun Chan, Pei DING | 2000-09-19 |
| 5418066 | Polyimide composition for polyimide/copper foil laminate | Han-Lung Chen, Syh-Ming Ho, Jing-Pin Pan | 1995-05-23 |
| 5372891 | Flexible copper/polyimide and barbituric acid modified bismaleimide blend/polyimide laminate | Tsai-An Yu, Jing-Pin Pan, Han-Lung Chen, Jinn-Shing King | 1994-12-13 |
| 5342736 | Method of wet etching of polyimide | Ker-Ming Chen, Shing-Shing King, Tzong-Ming Lee | 1994-08-30 |
| 5290909 | Polyimide composition for polyimide/copper foil laminate | Han-Lung Chen, Syh-Ming Ho, Jing-Pin Pan | 1994-03-01 |
| 5268432 | Heat resistant modified bismaleimide adhesive composition | Jing-Pin Pan, Shing-Yaw Hsu, Tzong-Ming Lee, Syh-Ming Ho | 1993-12-07 |
| 5217599 | Bonding of polyimide film | Ker-Ming Chen, Syh-Ming Ho, Richard Ping Cheng, Aina Hung | 1993-06-08 |
| 5200474 | Polyimide adhesive composition including barbituric acid modifier | Ker-Ming Chen, Jing-Pin Pan, Gwo-Yuh Shiau, Wei-Chun Chang | 1993-04-06 |