Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6632372 | Method of forming via-holes in multilayer circuit boards | Man-Lin Chen, Hsien-Kuang Lin, Tien-Shou Shieh, Pey-Ching Liou | 2003-10-14 |
| 6119338 | Method for manufacturing high-density multilayer printed circuit boards | Tsung-Hsiung Wang, Man-Lin Chen, Ming-Shun Chan, Pei DING | 2000-09-19 |