Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10759148 | Wood adhesive, method for adhering wood materials using the same, and composite wood structure using the same | Hsien-Kuang Lin, Sue-May Chen, Su-Huey Chen | 2020-09-01 |
| 10351737 | Wood adhesive | Hsien-Kuang Lin, Der-Jaw Chan, Sue-May Chen | 2019-07-16 |
| 10190026 | Wood adhesive | Hsien-Kuang Lin, Der-Jaw Chan, Sue-May Chen | 2019-01-29 |
| 9392688 | Biomass photosensitive material and method for manufacturing the same, and printed circuit board | Hsien-Kuang Lin, Sue-May Chen, Su-Huey Chen, YU-LIN LIU | 2016-07-12 |
| 8193258 | Sealant composition | Jauder Jeng, Pei-Ching Liu, Tien-Shou Shieh | 2012-06-05 |
| 6841266 | Photosensitive insulating film of organic light emitting diode (OLED) | Hsien-Kuang Lin, Pa-Yen Lu, Wen-Kuo Weng, Chun-Neng KU | 2005-01-11 |
| 6632372 | Method of forming via-holes in multilayer circuit boards | Hsien-Kuang Lin, Chuang-Shin Chiou, Tien-Shou Shieh, Pey-Ching Liou | 2003-10-14 |
| 6432613 | Photosensitive composition | Jing-Pin Pan, Hsien-Kuang Lin, Shur-Fen Liu | 2002-08-13 |
| 6119338 | Method for manufacturing high-density multilayer printed circuit boards | Tsung-Hsiung Wang, Chuang-Shin Chiou, Ming-Shun Chan, Pei DING | 2000-09-19 |