Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6281115 | Sidewall protection for a via hole formed in a photosensitive, low dielectric constant layer | Chung-Liang Chang | 2001-08-28 |
| 6251806 | Method to improve the roughness of metal deposition on low-k material | Chung-I Chang | 2001-06-26 |
| 6242361 | Plasma treatment to improve DUV photoresist process | Shyh-Dar Lee, Chien-Mei Wang, Shuo-Yen Chou | 2001-06-05 |
| 5985093 | Chemical-mechanical polish (CMP) pad conditioner | — | 1999-11-16 |
| 5976979 | Sequential oxygen plasma treatment and chemical mechanical polish (CMP) planarizing method for forming planarized low dielectric constant dielectric layer | — | 1999-11-02 |
| 5873769 | Temperature compensated chemical mechanical polishing to achieve uniform removal rates | Hung-Wen Chiou | 1999-02-23 |
| 5872043 | Method of planarizing wafers with shallow trench isolation | — | 1999-02-16 |
| 5858869 | Method for fabricating intermetal dielectric insulation using anisotropic plasma oxides and low dielectric constant polymers | Chien-Mei Wang | 1999-01-12 |
| 5834375 | Chemical-mechanical polishing planarization monitor | — | 1998-11-10 |
| 5834377 | In situ method for CMP endpoint detection | Hsueh-Chung Chen | 1998-11-10 |
| 5823854 | Chemical-mechanical polish (CMP) pad conditioner | — | 1998-10-20 |
| 5723387 | Method and apparatus for forming very small scale Cu interconnect metallurgy on semiconductor substrates | — | 1998-03-03 |
| 5681425 | Teos plasma protection technology | — | 1997-10-28 |
| 5647952 | Chemical/mechanical polish (CMP) endpoint method | — | 1997-07-15 |
| 5643050 | Chemical/mechanical polish (CMP) thickness monitor | — | 1997-07-01 |
| 5637031 | Electrochemical simulator for chemical-mechanical polishing (CMP) | — | 1997-06-10 |
| 5635425 | In-situ N.sub.2 plasma treatment for PE TEOS oxide deposition | — | 1997-06-03 |
| 5489553 | HF vapor surface treatment for the 03 teos gap filling deposition | — | 1996-02-06 |
| 5461010 | Two step etch back spin-on-glass process for semiconductor planarization | Shaw-Tzeng Hsia | 1995-10-24 |
| 5453406 | Aspect ratio independent coating for semiconductor planarization using SOG | — | 1995-09-26 |