Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10289169 | Cable cassette apparatus | Michael A. Cracraft, Khaalid P. J. McMillan, Arushi Shahani, John G. Torok | 2019-05-14 |
| 10268848 | Apparatus to detect cable seating or disturbance | Robert K. Mullady, Budy D. Notohardjono, Jacob T. Porter, Kenneth Scea, Robert B. Schlak | 2019-04-23 |
| 10228733 | Cable cassette apparatus | Michael A. Cracraft, Khaalid P. J. McMillan, Arushi Shahani, John G. Torok | 2019-03-12 |
| 10223490 | Signal via positioning in a multi-layer circuit board using a genetic via placement solver | Sungjun Chun, Michael A. Cracraft | 2019-03-05 |
| 10216884 | Signal via positioning in a multi-layer circuit board using a genetic via placement solver | Sungjun Chun, Michael A. Cracraft | 2019-02-26 |
| 10184962 | Removable transient voltage detector | Michael A. Cracraft | 2019-01-22 |
| 10172244 | Construction of printed circuit board having a buried via | Kyle Indukummar Giesen | 2019-01-01 |
| 10095278 | Cable cassette apparatus | Michael A. Cracraft, Khaalid P. J. McMillan, Arushi Shahani, John G. Torok | 2018-10-09 |
| 10019044 | Cable cassette apparatus | Michael A. Cracraft, Khaalid P. J. McMillan, Arushi Shahani, John G. Torok | 2018-07-10 |
| 9972566 | Interconnect array pattern with a 3:1 signal-to-ground ratio | Zhaoqing Chen, Rohan U. Mandrekar, Tingdong Zhou | 2018-05-15 |
| 9940426 | Signal via positioning in a multi-layer circuit board | Sungjun Chun, Michael A. Cracraft | 2018-04-10 |
| 9916410 | Signal via positioning in a multi-layer circuit board | Sungjun Chun, Michael A. Cracraft | 2018-03-13 |
| 9915682 | Non-permanent termination structure for microprobe measurements | Michael A. Cracraft, Jayapreetha Natesan, John G. Torok | 2018-03-13 |
| 9881115 | Signal via positioning in a multi-layer circuit board using a genetic via placement solver | Sungjun Chun, Michael A. Cracraft | 2018-01-30 |
| 9875331 | Signal via positioning in a multi-layer circuit board using a genetic via placement solver | Sungjun Chun, Michael A. Cracraft | 2018-01-23 |
| 9702906 | Non-permanent termination structure for microprobe measurements | Michael A. Cracraft, Jayapreetha Natesan, John G. Torok | 2017-07-11 |
| 9646925 | Interconnect array pattern with a 3:1 signal-to-ground ratio | Zhaoqing Chen, Rohan U. Mandrekar, Tingdong Zhou | 2017-05-09 |
| 9627787 | DIMM connector region vias and routing | Wiren D. Becker, William L. Brodsky, Michael A. Cracraft | 2017-04-18 |
| 9600619 | Distribution of power vias in a multi-layer circuit board | Zhaoqing Chen, Rohan U. Mandrekar, Tingdong Zhou | 2017-03-21 |
| 9594865 | Distribution of power vias in a multi-layer circuit board | Zhaoqing Chen, Rohan U. Mandrekar, Tingdong Zhou | 2017-03-14 |
| 9548551 | DIMM connector region vias and routing | Wiren D. Becker, William L. Brodsky, Michael A. Cracraft | 2017-01-17 |
| 9543241 | Interconnect array pattern with a 3:1 signal-to-ground ratio | Zhaoqing Chen, Rohan U. Mandrekar, Tingdong Zhou | 2017-01-10 |
| 9444162 | DIMM connector region vias and routing | Wiren D. Becker, William L. Brodsky, Michael A. Cracraft | 2016-09-13 |