Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11120189 | Single-ended-mode to mixed-mode transformer spice circuit model for high-speed system signal integrity simulations | — | 2021-09-14 |
| 10943044 | Transient and AC simulations with traveling wave probe circuit | — | 2021-03-09 |
| 10803220 | Transient and AC simulations with traveling wave probe circuit | — | 2020-10-13 |
| 10530422 | Behavioural circuit jitter model | — | 2020-01-07 |
| 9984188 | Single ended-mode to mixed-mode transformer spice circuit model for high-speed system signal integrity simulations | — | 2018-05-29 |
| 9984189 | Data clocked retimer model | — | 2018-05-29 |
| 9972566 | Interconnect array pattern with a 3:1 signal-to-ground ratio | Matteo Cocchini, Rohan U. Mandrekar, Tingdong Zhou | 2018-05-15 |
| 9858370 | Spice circuit model for twinaxial cable | — | 2018-01-02 |
| 9712315 | Reference clocked retimer model | — | 2017-07-18 |
| 9703908 | Spice circuit model for twinaxial cable | — | 2017-07-11 |
| 9697311 | Spice circuit model for twinaxial cable | — | 2017-07-04 |
| 9646925 | Interconnect array pattern with a 3:1 signal-to-ground ratio | Matteo Cocchini, Rohan U. Mandrekar, Tingdong Zhou | 2017-05-09 |
| 9600619 | Distribution of power vias in a multi-layer circuit board | Matteo Cocchini, Rohan U. Mandrekar, Tingdong Zhou | 2017-03-21 |
| 9594865 | Distribution of power vias in a multi-layer circuit board | Matteo Cocchini, Rohan U. Mandrekar, Tingdong Zhou | 2017-03-14 |
| 9543241 | Interconnect array pattern with a 3:1 signal-to-ground ratio | Matteo Cocchini, Rohan U. Mandrekar, Tingdong Zhou | 2017-01-10 |
| 9542516 | Spice circuit model for twinaxial cable | — | 2017-01-10 |
| 8203206 | Crosstalk reduction in electrical interconnects using differential signaling | Christian Schuster | 2012-06-19 |
| 7985927 | Ceramic substrate grid structure for the creation of virtual coax arrangement | Wiren D. Becker, George A. Katopis | 2011-07-26 |
| 7939930 | Crosstalk reduction in electrical interconnects using differential signaling | Christian Schuster | 2011-05-10 |
| 7897879 | Ceramic substrate grid structure for the creation of virtual coax arrangement | Wiren D. Becker, George A. Katopis | 2011-03-01 |
| 7465882 | Ceramic substrate grid structure for the creation of virtual coax arrangement | Wiren D. Becker, George A. Katopis | 2008-12-16 |
| 7335976 | Crosstalk reduction in electrical interconnects using differential signaling | Christian Schuster | 2008-02-26 |
| 7219046 | Characterizing input/output models | Jan Elizabeth Garrett-Hoffman, Hubert Harrer, Stephen White | 2007-05-15 |
| 7131080 | Simulation management system | Thaddeus Chen, Hubert Harrer, Jan Hoffman, Susan Marie Karwoski, Joonsuk Park +3 more | 2006-10-31 |
| 7111275 | Electronic circuit design analysis system | Thaddeus Chen, Hubert Harrer, Jan Hoffman, Susan Marie Karwoski, Joonsuk Park +2 more | 2006-09-19 |