Issued Patents All Time
Showing 626–650 of 826 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8889456 | Method of fabricating uniformly distributed self-assembled solder dot formation for high efficiency solar cells | Augustin J. Hong, Jeehwan Kim, Jae-Woong Nah | 2014-11-18 |
| 8889529 | Heterojunction bipolar transistors with thin epitaxial contacts | Bahman Hekmatshoar-Tabari, Tak H. Ning, Ghavam G. Shahidi, Davood Shahrjerdi | 2014-11-18 |
| 8878055 | Efficient nanoscale solar cell and fabrication method | Keith E. Fogel, William Graham, Jeehwan Kim, Harold J. Hovel, Katherine L. Saenger | 2014-11-04 |
| 8871620 | III-V photovoltaic elements | Stephen W. Bedell, Bahman Hekmatshoartabari, Davood Shahrjerdi | 2014-10-28 |
| 8866227 | Thin semiconductor-on-insulator MOSFET with co-integrated silicon, silicon germanium and silicon doped with carbon channels | Thomas N. Adam, Stephen W. Bedell, Kangguo Cheng, Bruce B. Doris, Ali Khakifirooz +2 more | 2014-10-21 |
| 8866003 | Solar cell employing an enhanced free hole density p-doped material and methods for forming the same | Ahmed Abou-Kandil, Keith E. Fogel, Jee H. Kim, Mohamed Saad | 2014-10-21 |
| 8860005 | Thin light emitting diode and fabrication method | Stephen W. Bedell, Bahman Hekmatshoartabari, Davood Shahrjerdi | 2014-10-14 |
| 8859348 | Strained silicon and strained silicon germanium on insulator | Stephen W. Bedell, Kangguo Cheng, Bruce B. Doris, Ali Khakifirooz | 2014-10-14 |
| 8859321 | Mixed temperature deposition of thin film silicon tandem cells | Ahmed Abou-Kandil, Keith E. Fogel, Augustin J. Hong, Jeehwan Kim | 2014-10-14 |
| 8853529 | Flexible III-V solar cell structure | Stephen W. Bedell, Cheng-Wei Cheng, Bahman Hekmatshoartabari, Ning Li, Davood Shahrjerdi | 2014-10-07 |
| 8841544 | Uniformly distributed self-assembled solder dot formation for high efficiency solar cells | Augustin J. Hong, Jeehwan Kim, Jae-Woong Nah | 2014-09-23 |
| 8841177 | Co-integration of elemental semiconductor devices and compound semiconductor devices | Tze-Chiang Chen, Cheng-Wei Cheng, Kuen-Ting Shiu | 2014-09-23 |
| 8841203 | Method for forming two device wafers from a single base substrate utilizing a controlled spalling process | Stephen W. Bedell, Keith E. Fogel, Paul A. Lauro, Davood Shahrjerdi | 2014-09-23 |
| 8829339 | Field-effect inter-digitated back contact photovoltaic device | Keith E. Fogel, Bahman Hekmatshoartabari, Ghavam G. Shahidi, Davood Shahrjerdi | 2014-09-09 |
| 8828504 | Deposition of hydrogenated thin film | Osama Tobail, Ahmed Abou-Kandil, Mostafa M. El-Ashry, Jeehwan Kim, Paul Kozlowski +1 more | 2014-09-09 |
| 8823127 | Multijunction photovoltaic cell fabrication | Stephen W. Bedell, Norma Sosa Cortes, Keith E. Fogel, Davood Shahrjerdi | 2014-09-02 |
| 8823143 | Electrodeposition method for forming Ge on semiconductor substrates | Stephen W. Bedell, Hariklia Deligianni, Qiang Huang, Lubomyr T. Romankiw, Katherine L. Saenger | 2014-09-02 |
| 8822317 | Self-aligned III-V MOSFET diffusion regions and silicide-like alloy contact | Cheng-Wei Cheng, Augustin J. Hong, Jeehwan Kim, Kuen-Ting Shiu | 2014-09-02 |
| 8809168 | Growing compressively strained silicon directly on silicon at low temperatures | Stephen W. Bedell, Bahman Hekmatshoartabari, Alexander Reznicek, Ghavam G. Shahidi, Davood Shahrjerdi | 2014-08-19 |
| 8802477 | Heterojunction III-V photovoltaic cell fabrication | Stephen W. Bedell, Norma E. Sosa Cortes, Keith E. Fogel, Ghavam G. Shahidi, Davood Shahrjerdi | 2014-08-12 |
| 8795502 | Electrodeposition under illumination without electrical contacts | John M. Cotte, Harold J. Hovel, Xiaoyan Shao, Steven E. Steen | 2014-08-05 |
| 8791487 | Zinc oxide-containing transparent conductive electrode | Keith E. Fogel, Ning Li | 2014-07-29 |
| 8790937 | Zinc oxide-containing transparent conductive electrode | Keith E. Fogel, Ning Li | 2014-07-29 |
| 8778448 | Method of stabilizing hydrogenated amorphous silicon and amorphous hydrogenated silicon alloys | Bahman Hekmatshoar-Tabari, Marinus Hopstaken, Dae-Gyu Park, Ghavam G. Shahidi, Davood Shahrjerdi | 2014-07-15 |
| 8772116 | Dielectric equivalent thickness and capacitance scaling for semiconductor devices | Alessandro C. Callegari, Ko-Tao Lee, Kuen-Ting Shiu | 2014-07-08 |