Issued Patents All Time
Showing 101–115 of 115 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7202685 | Embedded probe-enabling socket with integral probe structures | Gerald K. Bartley, Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson | 2007-04-10 |
| 7088200 | Method and structure to control common mode impedance in fan-out regions | Gerald K. Bartley, Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson | 2006-08-08 |
| 7088199 | Method and stiffener-embedded waveguide structure for implementing enhanced data transfer | Gerald K. Bartley, Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson | 2006-08-08 |
| 7074050 | Socket assembly with incorporated memory structure | Gerald K. Bartley, Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson | 2006-07-11 |
| 7055119 | Customized mesh plane, method and computer program product for creating customized mesh planes within electronic packages | Gerald K. Bartley | 2006-05-30 |
| 7050871 | Method and apparatus for implementing silicon wafer chip carrier passive devices | Gerald K. Bartley, Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson +1 more | 2006-05-23 |
| 7036710 | Method and structures for implementing impedance-controlled coupled noise suppressor for differential interface solder column array | Gerald K. Bartley, Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson | 2006-05-02 |
| 7036709 | Method and structure for implementing column attach coupled noise suppressor | Gerald K. Bartley, Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson | 2006-05-02 |
| 6998852 | Method and apparatus for implementing direct attenuation measurement through embedded structure excitation | Gerald K. Bartley, Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson | 2006-02-14 |
| 6993739 | Method, structure, and computer program product for implementing high frequency return current paths within electronic packages | Daniel Douriet, Matthew S. Doyle, Andrew Benson Maki, Joel D. Ziegelbein | 2006-01-31 |
| 6261404 | Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device | Douglas A. Baska, James D. Bielick, Phillip Duane Isaacs, Michael L. Zumbrunnen | 2001-07-17 |
| 5905636 | Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device | Douglas A. Baska, James D. Bielick, Phillip Duane Isaacs, Michael L. Zumbrunnen | 1999-05-18 |
| 5745344 | Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device | Douglas A. Baska, James D. Bielick, Phillip Duane Isaacs, Michael L. Zumbrunnen | 1998-04-28 |
| 5419483 | Method and apparatus for manufacturing a printed circuit card and connector assembly | Brian Hanson, Donald E. Hora, James Larry Peacock | 1995-05-30 |
| 5318212 | Method and apparatus for manufacturing a printed circuit card and connector assembly | Brian Hanson, Donald E. Hora, James Larry Peacock | 1994-06-07 |