DM

Daniel N. Maynard

IBM: 33 patents #2,996 of 70,183Top 5%
📍 Newport, VT: #1 of 17 inventorsTop 6%
🗺 Vermont: #212 of 4,968 inventorsTop 5%
Overall (All Time): #108,590 of 4,157,543Top 3%
33
Patents All Time

Issued Patents All Time

Showing 26–33 of 33 patents

Patent #TitleCo-InventorsDate
7076749 Method and system for improving integrated circuit manufacturing productivity Douglas W. Kemerer, Gustavo E. Tellez, Lijiang Wang, Peter S. Wissell 2006-07-11
6823496 Physical design characterization system Bette L. Bergman Reuter, Mitchell R. DeHond, William C. Leipold, Brian D. Pfeifer, David C. Reynolds +1 more 2004-11-23
6738954 Method for prediction random defect yields of integrated circuits with accuracy and computation time controls Archibald J. Allen, Wilm E. Donath, Alan Dziedzic, Mark A. Lavin, Dennis M. Newns +1 more 2004-05-18
6394638 Trench isolation for active areas and first level conductors Edward W. Sengle, Mark D. Jaffe, Mark A. Lavin, Eric J. White, John A. Bracchitta 2002-05-28
6063687 Formation of trench isolation for active areas and first level conductors Edward W. Sengle, Mark D. Jaffe, Mark A. Lavin, Eric J. White, John A. Bracchitta 2000-05-16
6021267 Aspect ratio program for optimizing semiconductor chip shape Jeffrey P. Bonn, Sharon B. Sisler, Richard Charles Whiteside 2000-02-01
5734192 Trench isolation for active areas and first level conductors Edward W. Sengle, Mark D. Jaffe, Mark A. Lavin, Eric J. White, John A. Bracchitta 1998-03-31
5636133 Efficient generation of fill shapes for chips and packages Donald G. Chesebro, Young Ouk Kim, Mark A. Lavin 1997-06-03