Issued Patents All Time
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9210831 | Separable and integrated heat sinks facilitating cooling multi-compnent electronic assembly | Levi A. Campbell, Michael J. Ellsworth, Jr., Eric J. McKeever | 2015-12-08 |
| 9144178 | Selective clamping of electronics card to coolant-cooled structure | Mark A. Brandon, Levi A. Campbell, Tan D. Doan, Michael J. Ellsworth, Jr., Randall G. Kemink +1 more | 2015-09-22 |
| 8385067 | In-line memory and circuit board cooling system | Jason R. Eagle, Eric A. Eckberg, Gary F. Goth, Katie L. Pizzolato, Scott A. Shurson | 2013-02-26 |
| 7928562 | Segmentation of a die stack for 3D packaging thermal management | Evan G. Colgan, John Harold Magerlein, Kenneth C. Marston, Kathryn C. Rivera, Kamal K. Sikka +3 more | 2011-04-19 |
| 7031162 | Method and structure for cooling a dual chip module with one high power chip | Kamal K. Sikka, Hilton T. Toy | 2006-04-18 |