Issued Patents All Time
Showing 76–89 of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7855342 | Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board | Hajime Sakamoto | 2010-12-21 |
| 7855894 | Printed circuit board | Yasushi Inagaki, Motoo Asai, Hideo Yabashi, Seiji Shirai | 2010-12-21 |
| 7852634 | Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board | Hajime Sakamoto | 2010-12-14 |
| 7842887 | Multilayer printed circuit board | Hajime Sakamoto, Tadashi Sugiyama, Takashi Kariya | 2010-11-30 |
| 7535095 | Printed wiring board and method for producing the same | Honchin En, Masayuki Hayashi, Kenichi Shimada, Motoo Asai, Koji Sekine +3 more | 2009-05-19 |
| 7504719 | Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same | Honchin En, Masayuki Hayashi, Kenichi Shimada, Motoo Asai, Koji Sekine +3 more | 2009-03-17 |
| 7435910 | Multilayer printed circuit board | Hajime Sakamoto, Tadashi Sugiyama, Takashi Kariya | 2008-10-14 |
| 7342803 | Printed circuit board and method of manufacturing printed circuit board | Yasushi Inagaki, Motoo Asai, Hideo Yabashi, Seiji Shirai | 2008-03-11 |
| 7307852 | Printed circuit board and method for manufacturing printed circuit board | Yasushi Inagaki, Motoo Asai, Hideo Yabashi, Seiji Shirai | 2007-12-11 |
| 6909054 | Multilayer printed wiring board and method for producing multilayer printed wiring board | Hajime Sakamoto, Tadashi Sugiyama, Takashi Kariya | 2005-06-21 |
| 6876554 | Printing wiring board and method of producing the same and capacitor to be contained in printed wiring board | Yasushi Inagaki, Motoo Asai, Hideo Yabashi, Seiji Shirai | 2005-04-05 |
| 6828510 | Multilayer printed wiring board and method of manufacturing multilayer printed wiring board | Motoo Asai, Takahiro Mori | 2004-12-07 |
| 6724638 | Printed wiring board and method of producing the same | Yasushi Inagaki, Motoo Asai, Hideo Yabashi, Seiji Shirai | 2004-04-20 |
| 6586276 | Method for fabricating a microelectronic device using wafer-level adhesion layer deposition | Steven Towle, Hajime Sakamoto | 2003-07-01 |