Issued Patents All Time
Showing 26–50 of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8822830 | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board | Motoo Asai, Takahiro Mori | 2014-09-02 |
| 8810475 | Antenna device | Tadahiko Maeda, Masataka Ito, Yoshitsugu Wakazono, Yasuhiko Mano | 2014-08-19 |
| 8782882 | Method of manufacturing multi-layer printed circuit board | Motoo Asai, Takahiro Mori | 2014-07-22 |
| 8780573 | Printed circuit board | Yasushi Inagaki, Motoo Asai, Hideo Yabashi, Seiji Shirai | 2014-07-15 |
| 8763241 | Method of manufacturing printed wiring board | Yasushi Inagaki, Motoo Asai, Hideo Yabashi, Seiji Shirai | 2014-07-01 |
| 8745863 | Method of manufacturing multi-layer printed circuit board | Motoo Asai, Takahiro Mori | 2014-06-10 |
| 8717772 | Printed circuit board | Yasushi Inagaki, Motoo Asai, Hideo Yabashi, Seiji Shirai | 2014-05-06 |
| 8705909 | Optical interconnect | Masataka Ito, Christopher Lee Keller, Yoshitsugu Wakazono | 2014-04-22 |
| 8705907 | Optical interconnect device and method for manufacturing the same | Zhenhua Shao, Xu Huang, Masataka Ito, Christopher Lee Keller | 2014-04-22 |
| 8573842 | Sensor control circuit and sensor | Zhenhua Shao, Christopher Lee Keller, Masataka Ito | 2013-11-05 |
| 8533943 | Printed wiring board and method for producing the same | Honchin En, Masayuki Hayashi, Kenichi Shimada, Motoo Asai, Koji Sekine +3 more | 2013-09-17 |
| 8524535 | Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board | Hajime Sakamoto | 2013-09-03 |
| 8453323 | Printed circuit board manufacturing method | Hajime Sakamoto, Tadashi Sugiyama, Takashi Kariya | 2013-06-04 |
| 8438727 | Multilayer printed circuit board and multilayer printed circuit board manufacturing method | Hajime Sakamoto, Tadashi Sugiyama, Takashi Kariya | 2013-05-14 |
| 8340480 | Opto-electrical hybrid wiring board and method for manufacturing the same | Masataka Ito | 2012-12-25 |
| 8331102 | Printed circuit board | Yasushi Inagaki, Motoo Asai, Hideo Yabashi, Seiji Shirai | 2012-12-11 |
| 8293579 | Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board | Hajime Sakamoto | 2012-10-23 |
| 8288665 | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board | Motoo Asai, Takahiro Mori | 2012-10-16 |
| 8288664 | Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board | Motoo Asai, Takahiro Mori | 2012-10-16 |
| 8283573 | Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board | Motoo Asai, Takahiro Mori | 2012-10-09 |
| 8275223 | Opto-electrical hybrid wiring board and method for manufacturing the same | Masataka Ito | 2012-09-25 |
| 8186045 | Multilayer printed circuit board and multilayer printed circuit board manufacturing method | Hajime Sakamoto, Tadashi Sugiyama, Takashi Kariya | 2012-05-29 |
| 8157456 | Optical interconnect device and method for manufacturing the same | Zhenhua Shao, Xu Huang, Masataka Ito, Christopher Lee Keller | 2012-04-17 |
| 8116091 | Printed circuit board | Yasushi Inagaki, Motoo Asai, Hideo Yabashi, Seiji Shirai | 2012-02-14 |
| 8107253 | Printed circuit board | Yasushi Inagaki, Motoo Asai, Hideo Yabashi, Seiji Shirai | 2012-01-31 |