Issued Patents All Time
Showing 1–25 of 115 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9060446 | Printed circuit board | Yasushi Inagaki, Dongdong Wang, Hideo Yabashi, Seiji Shirai | 2015-06-16 |
| 8987603 | Multilayer printed wiring board with filled viahole structure | Seiji Shirai, Kenichi Shimada | 2015-03-24 |
| 8842440 | Printed circuit board and method of manufacturing printed circuit board | Yasushi Inagaki, Dongdong Wang, Hideo Yabashi, Seiji Shirai | 2014-09-23 |
| 8830691 | Printed circuit board and method of manufacturing printed circuit board | Yasushi Inagaki, Dongdong Wang, Hideo Yabashi, Seiji Shirai | 2014-09-09 |
| 8822830 | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board | Dongdong Wang, Takahiro Mori | 2014-09-02 |
| 8822828 | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board | Dongdong Wang, Takahiro Mori | 2014-09-02 |
| 8782882 | Method of manufacturing multi-layer printed circuit board | Dongdong Wang, Takahiro Mori | 2014-07-22 |
| 8780573 | Printed circuit board | Yasushi Inagaki, Dongdong Wang, Hideo Yabashi, Seiji Shirai | 2014-07-15 |
| 8763241 | Method of manufacturing printed wiring board | Yasushi Inagaki, Dongdong Wang, Hideo Yabashi, Seiji Shirai | 2014-07-01 |
| 8745863 | Method of manufacturing multi-layer printed circuit board | Dongdong Wang, Takahiro Mori | 2014-06-10 |
| 8717772 | Printed circuit board | Yasushi Inagaki, Dongdong Wang, Hideo Yabashi, Seiji Shirai | 2014-05-06 |
| 8533943 | Printed wiring board and method for producing the same | Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Koji Sekine +3 more | 2013-09-17 |
| RE44251 | Circuit board for mounting electronic parts | Yoichiro Kawamura, Yoji Mori | 2013-06-04 |
| 8331102 | Printed circuit board | Yasushi Inagaki, Dongdong Wang, Hideo Yabashi, Seiji Shirai | 2012-12-11 |
| 8288665 | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board | Dongdong Wang, Takahiro Mori | 2012-10-16 |
| 8288664 | Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board | Dongdong Wang, Takahiro Mori | 2012-10-16 |
| 8283573 | Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board | Dongdong Wang, Takahiro Mori | 2012-10-09 |
| 8249402 | Multilayer printed circuit board | Hiroaki Kodama, Kazuhito Yamada | 2012-08-21 |
| 8238700 | Multilayer printed circuit board | Hiroaki Kodama, Kazuhito Yamada | 2012-08-07 |
| RE43509 | Printed wiring board and method for manufacturing the same | Yasuji Hiramatsu, Yoshinori Wakihara, Kazuhito Yamada | 2012-07-17 |
| 8120040 | Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication | Hiroaki Kodama, Toyoaki Tanaka | 2012-02-21 |
| 8116091 | Printed circuit board | Yasushi Inagaki, Dongdong Wang, Hideo Yabashi, Seiji Shirai | 2012-02-14 |
| 8115111 | Multilayer printed wiring board with filled viahole structure | Seiji Shirai, Kenichi Shimada | 2012-02-14 |
| 8107253 | Printed circuit board | Yasushi Inagaki, Dongdong Wang, Hideo Yabashi, Seiji Shirai | 2012-01-31 |
| 8093507 | Printed wiring board and method for producing the same | Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Koji Sekine +3 more | 2012-01-10 |