Issued Patents All Time
Showing 51–75 of 115 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE41242 | Package substrate | Yoji Mori | 2010-04-20 |
| 7693382 | Substrate for mounting IC chip, multilayered printed circuit board, and device for optical communication | — | 2010-04-06 |
| RE41051 | Package substrate | Yoji Mori | 2009-12-22 |
| 7622183 | Multilayer printed wiring board with filled viahole structure | Seiji Shirai, Kenichi Shimada | 2009-11-24 |
| 7615162 | Printed wiring board and method for manufacturing the same | Yasuji Hiramatsu, Yoshinori Wakihara, Kazuhito Yamada | 2009-11-10 |
| RE40947 | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole | Kenichi Shimada, Kouta Noda, Takashi Kariya, Hiroshi Segawa | 2009-10-27 |
| 7535095 | Printed wiring board and method for producing the same | Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Koji Sekine +3 more | 2009-05-19 |
| 7526152 | Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboard | Hiroaki Kodama | 2009-04-28 |
| 7504719 | Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same | Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Koji Sekine +3 more | 2009-03-17 |
| 7437030 | Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboard | Hiroaki Kodama | 2008-10-14 |
| 7390974 | Multilayer printed wiring board with filled viahole structure | Seiji Shirai, Kenichi Shimada | 2008-06-24 |
| 7388159 | Printed wiring board and method for manufacturing the same | — | 2008-06-17 |
| 7385146 | Printed wiring board and method for manufacturing the same | Yasuji Hiramatsu | 2008-06-10 |
| 7375289 | Multi-layer printed wiring board including an alignment mark as an index for a position of via holes | Yasuji Hiramatsu, Naohiro Hirose, Takashi Kariya | 2008-05-20 |
| 7361849 | Printed wiring board and method for manufacturing the same | Yasuji Hiramatsu | 2008-04-22 |
| 7342803 | Printed circuit board and method of manufacturing printed circuit board | Yasushi Inagaki, Dongdong Wang, Hideo Yabashi, Seiji Shirai | 2008-03-11 |
| 7307852 | Printed circuit board and method for manufacturing printed circuit board | Yasushi Inagaki, Dongdong Wang, Hideo Yabashi, Seiji Shirai | 2007-12-11 |
| 7127812 | Process for producing a multi-layer printed wiring board | Yasuji Hiramatsu, Naohiro Hirose, Takashi Kariya | 2006-10-31 |
| 7071424 | Multilayer printed wiring board having filled-via structure | Seiji Shirai, Kenichi Shimada | 2006-07-04 |
| 7070207 | Substrate for mounting IC chip, multilayerd printed circuit board, and device for optical communication | — | 2006-07-04 |
| 6876554 | Printing wiring board and method of producing the same and capacitor to be contained in printed wiring board | Yasushi Inagaki, Dongdong Wang, Hideo Yabashi, Seiji Shirai | 2005-04-05 |
| 6835895 | Printed wiring board and method for manufacturing the same | Yasuji Hiramatsu | 2004-12-28 |
| 6831234 | Multilayer printed circuit board | Yoichiro Kawamura | 2004-12-14 |
| 6828510 | Multilayer printed wiring board and method of manufacturing multilayer printed wiring board | Dongdong Wang, Takahiro Mori | 2004-12-07 |
| 6762921 | Multilayer printed-circuit board and method of manufacture | Kouta Noda, Takashi Kariya | 2004-07-13 |