Issued Patents All Time
Showing 76–100 of 115 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6724638 | Printed wiring board and method of producing the same | Yasushi Inagaki, Dongdong Wang, Hideo Yabashi, Seiji Shirai | 2004-04-20 |
| 6609297 | Method of manufacturing multilayer printed wiring board | Yasuji Hiramatsu, Naohiro Hirose, Takashi Kariya | 2003-08-26 |
| 6607825 | Metal film bonded body, bonding agent layer and bonding agent | Dong Wang | 2003-08-19 |
| 6534723 | Multilayer printed-circuit board and semiconductor device | Takashi Kariya | 2003-03-18 |
| 6525275 | Multilayer printed circuit boards | — | 2003-02-25 |
| 6490170 | Package substrate | Yoji Mori | 2002-12-03 |
| 6487088 | Package substrate | Yoji Mori | 2002-11-26 |
| 6451932 | Resin composites and method for producing the same | Dong Wang | 2002-09-17 |
| 6411519 | Package substrate | Yoji Mori | 2002-06-25 |
| 6392898 | Package substrate | Yoji Mori | 2002-05-21 |
| 6384344 | Circuit board for mounting electronic parts | Yoichiro Kawamura, Yoji Mori | 2002-05-07 |
| 6376049 | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole | Kenichi Shimada, Kouta Noda, Takashi Kariya, Hiroshi Segawa | 2002-04-23 |
| 6376052 | Multilayer printed wiring board and its production process, resin composition for filling through-hole | Ken Shimada, Kouta Noda, Takashi Kariya, Hiroshi Segawa | 2002-04-23 |
| 6365843 | Multilayer printed wiring board | Seiji Shirai, Kenichi Shimada | 2002-04-02 |
| 6326556 | Multilayered printed wiring board | Akihito Nakamura | 2001-12-04 |
| 6306980 | Resin composites and method for producing the same | Dong Wang | 2001-10-23 |
| 6303880 | Printed circuit boards | Masato Kawade, Shinji Hiratuka | 2001-10-16 |
| 6294621 | Resin composites and method for producing the same | Dong Wang | 2001-09-25 |
| 6291778 | Printed circuit boards | Masato Kawade, Shinji Hiratuka | 2001-09-18 |
| 6265498 | Resin composites and method for producing the same | Dong Wang | 2001-07-24 |
| 6261671 | Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board | Yoshitaka Ono, Masato Kawade, Kouta Noda, Youko Nishiwaki | 2001-07-17 |
| 6251502 | Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler | Toshihiko Yasue, Yasuji Hiramatsu, Hideki Yano, Yoshifumi Ishitani, Yoichiro Kawamura +3 more | 2001-06-26 |
| 6248428 | Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board | Yoshitaka Ono, Masato Kawade, Kouta Noda, Youko Nishiwaki | 2001-06-19 |
| 6217987 | Solder resist composition and printed circuit boards | Yoshitaka Ono, Akihiko Goto, Ayao Niki | 2001-04-17 |
| 6217988 | Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler | Toshihiko Yasue, Yasuji Hiramatsu, Hideki Yano, Yoshifumi Ishitani, Yoichiro Kawamura +3 more | 2001-04-17 |