Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6261671 | Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board | Motoo Asai, Yoshitaka Ono, Masato Kawade, Kouta Noda | 2001-07-17 |
| 6248428 | Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board | Motoo Asai, Yoshitaka Ono, Masato Kawade, Kouta Noda | 2001-06-19 |