Issued Patents All Time
Showing 101–115 of 115 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6174353 | Pretreating solution for electroless plating, electroless plating bath and electroless plating process | Benzhen Yuan | 2001-01-16 |
| 6146700 | Pretreating solution for electroless plating, electroless plating bath and electroless plating process | Benzhen Yuan | 2000-11-14 |
| 6124408 | Resin composites and method for producing the same | Dong Wang | 2000-09-26 |
| 6010768 | Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler | Toshihiko Yasue, Yasuji Hiramatsu, Hideki Yano, Yoshifumi Ishitani, Yoichiro Kawamura +3 more | 2000-01-04 |
| 5994480 | Resin composites and method for producing the same | Dong Wang | 1999-11-30 |
| 5795618 | Polymerizable adhesive (comprising cured amino resin powder) for print ed circuit board | Chie Onishi | 1998-08-18 |
| 5741575 | Adhesive for printed circuit board | Chie Onishi | 1998-04-21 |
| 5688583 | Adhesive for printed circuit board | Chie Onishi | 1997-11-18 |
| 5589250 | Resin compositions and printed circuit boards using the same | Ritsuko Kato | 1996-12-31 |
| 5589255 | Adhesive for electroless plating, printed circuit boards and method of producing the same | Ryo Enomoto | 1996-12-31 |
| 5519177 | Adhesives, adhesive layers for electroless plating and printed circuit boards | Dong Wang | 1996-05-21 |
| 5447996 | Adhesive comprising cured amino resin powder for printed circuit board | Chie Onishi | 1995-09-05 |
| 5344893 | Epoxy/amino powder resin adhesive for printed circuit board | Chie Onishi | 1994-09-06 |
| 5175060 | Leadframe semiconductor-mounting substrate having a roughened adhesive conductor circuit substrate and method of producing the same | Ryo Enomoto, Yoshikazu Sakaguchi | 1992-12-29 |
| 5055321 | Adhesive for electroless plating, printed circuit boards and method of producing the same | Ryo Enomoto | 1991-10-08 |