Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8533943 | Printed wiring board and method for producing the same | Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine +3 more | 2013-09-17 |
| 8093507 | Printed wiring board and method for producing the same | Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine +3 more | 2012-01-10 |
| 8065794 | Printed wiring board and its manufacturing method | Tohru Nakai, Takeo Oki, Naohiro Hirose, Kouta Noda | 2011-11-29 |
| 8030577 | Printed wiring board and method for producing the same | Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine +3 more | 2011-10-04 |
| 8020291 | Method of manufacturing a printed wiring board | Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine +3 more | 2011-09-20 |
| 8018045 | Printed circuit board | Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine +3 more | 2011-09-13 |
| 8006377 | Method for producing a printed wiring board | Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine +3 more | 2011-08-30 |
| 7994433 | Printed wiring board and method for producing the same | Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine +3 more | 2011-08-09 |
| 7993510 | Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board | — | 2011-08-09 |
| 7827680 | Electroplating process of electroplating an elecrically conductive sustrate | Tohru Nakai, Takeo Oki, Naohiro Hirose, Kouta Noda | 2010-11-09 |
| 7812262 | Multilayer printed circuit board | — | 2010-10-12 |
| 7691189 | Printed wiring board and its manufacturing method | Tohru Nakai, Takeo Oki, Naohiro Hirose, Kouta Noda | 2010-04-06 |
| 7535095 | Printed wiring board and method for producing the same | Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine +3 more | 2009-05-19 |
| 7514637 | Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board | — | 2009-04-07 |
| 7504719 | Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same | Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine +3 more | 2009-03-17 |
| 7446263 | Multilayer printed circuit board | — | 2008-11-04 |
| 7230188 | Printed wiring board and its manufacturing method | Tohru Nakai, Takeo Oki, Naohiro Hirose, Kouta Noda | 2007-06-12 |
| 6242079 | Printed wiring board and method for manufacturing the same | Yukinobu Mikado, Yasuji Hiramatsu | 2001-06-05 |