Issued Patents All Time
Showing 1–25 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10927226 | Prepreg and method for producing same | Takaya Suzuki, Toyoaki Ishiwata, Yoshitaka Umemoto | 2021-02-23 |
| 10804191 | Printed wiring board | Yoji Sawada | 2020-10-13 |
| 10186486 | Wiring board | Keisuke Shimizu | 2019-01-22 |
| 10090238 | Wiring substrate and method for manufacturing the same | Keisuke Shimizu | 2018-10-02 |
| 9893016 | Multilayer wiring board having wiring structure for mounting multiple electronic components and method for manufacturing the same | Yoshinori Shizuno, Shigeru Yamada, Takashi Kariya | 2018-02-13 |
| 9837342 | Multilayer wiring board and method for manufacturing same | — | 2017-12-05 |
| 9711439 | Printed wiring board and method for manufacturing the same | Nobuya Takahashi | 2017-07-18 |
| 9706663 | Printed wiring board, method for manufacturing the same and semiconductor device | Masatoshi Kunieda, Makoto Terui, Takashi Kariya | 2017-07-11 |
| 9420697 | Method for manufacturing printed wiring board | Yoshiyuki Iwata, Masaru Hori | 2016-08-16 |
| 9245838 | Semiconductor element | Dongdong Wang | 2016-01-26 |
| 8997344 | Method for manufacturing interposer | Shuichi Kawano, Daiki Komatsu, Hiroshi Segawa | 2015-04-07 |
| 8959756 | Method of manufacturing a printed circuit board having an embedded electronic component | Dongdong Wang | 2015-02-24 |
| 8822323 | Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board | Dongdong Wang | 2014-09-02 |
| 8524535 | Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board | Dongdong Wang | 2013-09-03 |
| 8453323 | Printed circuit board manufacturing method | Tadashi Sugiyama, Dongdong Wang, Takashi Kariya | 2013-06-04 |
| 8438727 | Multilayer printed circuit board and multilayer printed circuit board manufacturing method | Tadashi Sugiyama, Dongdong Wang, Takashi Kariya | 2013-05-14 |
| 8293579 | Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board | Dongdong Wang | 2012-10-23 |
| 8188378 | Interposer and method for manufacturing interposer | Shuichi Kawano, Daiki Komatsu, Toshiki Furutani, Hiroshi Segawa | 2012-05-29 |
| 8186045 | Multilayer printed circuit board and multilayer printed circuit board manufacturing method | Tadashi Sugiyama, Dongdong Wang, Takashi Kariya | 2012-05-29 |
| 8178790 | Interposer and method for manufacturing interposer | Toshiki Furutani, Atsushi Sakai, Kiyohisa Hasegawa, Hiroshi Segawa, Shuichi Kawano | 2012-05-15 |
| 8173907 | Interposer and method for manufacturing interposer | Shuichi Kawano, Daiki Komatsu, Hiroshi Segawa | 2012-05-08 |
| 8079142 | Printed circuit board manufacturing method | Tadashi Sugiyama, Dongdong Wang, Takashi Kariya | 2011-12-20 |
| 8067699 | Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board | Dongdong Wang | 2011-11-29 |
| 8058563 | Interposer and method for manufacturing interposer | Toshiki Furutani, Hiroshi Segawa | 2011-11-15 |
| 8046914 | Method for manufacturing multilayer printed circuit board | Tadashi Sugiyama, Dongdong Wang, Takashi Kariya | 2011-11-01 |