HS

Hajime Sakamoto

IC Ibiden Co.: 37 patents #13 of 730Top 2%
NU National University Corporation Nagoya University: 1 patents #247 of 782Top 35%
TC Toho Tenax Co.: 1 patents #11 of 48Top 25%
IN Intel: 1 patents #18,218 of 30,777Top 60%
Overall (All Time): #82,693 of 4,157,543Top 2%
39
Patents All Time

Issued Patents All Time

Showing 26–39 of 39 patents

Patent #TitleCo-InventorsDate
7999387 Semiconductor element connected to printed circuit board Dongdong Wang 2011-08-16
7908745 Method of manufacturing multi-layer printed circuit board Dongdong Wang 2011-03-22
7893360 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board Dongdong Wang 2011-02-22
7888606 Multilayer printed circuit board Tadashi Sugiyama, Dongdong Wang, Takashi Kariya 2011-02-15
7888605 Multilayer printed circuit board Tadashi Sugiyama, Dongdong Wang, Takashi Kariya 2011-02-15
7884286 Multilayer printed circuit board Tadashi Sugiyama, Dongdong Wang, Takashi Kariya 2011-02-08
7855342 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board Dongdong Wang 2010-12-21
7852634 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board Dongdong Wang 2010-12-14
7842887 Multilayer printed circuit board Tadashi Sugiyama, Dongdong Wang, Takashi Kariya 2010-11-30
7662694 Capacitor having adjustable capacitance, and printed wiring board having the same Takashi Kariya, Yasuhiko Mano 2010-02-16
7435910 Multilayer printed circuit board Tadashi Sugiyama, Dongdong Wang, Takashi Kariya 2008-10-14
6909054 Multilayer printed wiring board and method for producing multilayer printed wiring board Tadashi Sugiyama, Dongdong Wang, Takashi Kariya 2005-06-21
6889433 Method of manufacturing printed-circuit board Ryo Enomoto, Takashi Kariya 2005-05-10
6586276 Method for fabricating a microelectronic device using wafer-level adhesion layer deposition Steven Towle, Dongdong Wang 2003-07-01