Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7220065 | Connection apparatus for parallel optical interconnect module and parallel optical interconnect module using the same | Sang-Pil Han, In Kui CHO, Chul-Sik Kee, Hee Kyung Sung | 2007-05-22 |
| 7149389 | Optical printed circuit board system having tapered waveguide | Keun Yoon, In Kui CHO, Myung Yung Jeong | 2006-12-12 |
| 7031584 | Method for manufacturing optical waveguide using laser direct writing method and optical waveguide manufactured by using the same | Woo Jin Lee, Keun Yoon, Myung Yung Jeong | 2006-04-18 |
| 6955564 | Differential pair interconnection apparatus | In Kui CHO, Keun Yoon, Sang-Pil Han, Myung Yung Jeong | 2005-10-18 |
| 6912332 | Parallel optical interconnection module and method for manufacturing the same | Sang-Pil Han, Choon Gi Choi, Byeong Cheol Kim, In Kui CHO, Myung Yung Jeong | 2005-06-28 |
| 6877912 | Electro-optical circuit board having optical transmit/receive module and optical waveguide | In Kui CHO, Keun Yoon, Sang-Pil Han, Myung Yung Jeong | 2005-04-12 |
| 6213817 | Compliant press-fit pin having compliant cantilever beam | Myung Yung Jeong, Sang Kuk Choi, Dong Pil Shin, Tae Goo Choy | 2001-04-10 |
| 6129865 | Manufacturing method of multifiber connector ferrule for ribbon-type optical cable | Myung Yung Jeong, Oh-Gone Chun, Tae Goo Choy, Hong Joon Chun | 2000-10-10 |
| 5983702 | Compound testing machine for testing various mechanical properties used for optical connector | Sang Ho Park, Oh-Gone Chun, Myung Yung Jeong, Tae Goo Choy, Han Dae Cho | 1999-11-16 |
| 5897339 | Lead-on-chip semiconductor device package having an adhesive layer formed from liquid adhesive and method for manufacturing the same | Young Jae Song, Se-Yong Oh, Tae-Je Cho, Min Ho Lee | 1999-04-27 |
| 5799122 | Multifiber optical connector | Myung Yung Jeong, Sang Ho Park, Oh-Gone Chun, Tae Goo Choy, Hak-Seok Kim | 1998-08-25 |
| 5744827 | Three dimensional stack package device having exposed coupling lead portions and vertical interconnection elements | Do Soo Jeong, Min Cheol An, Hyeon J. Jeong, Ki-Won Choi | 1998-04-28 |
| 5727102 | Multifiber optical connector for optical ribbon cable | Myung Yung Jeong, Oh-Gone Chun, Tae Goo Choy | 1998-03-10 |
| 5677569 | Semiconductor multi-package stack | Ki-Won Choi, Seung-Kon Mok | 1997-10-14 |
| 5625221 | Semiconductor assembly for a three-dimensional integrated circuit package | Jae June Kim, Dong Kwan Kim | 1997-04-29 |
| 5621242 | Semiconductor package having support film formed on inner leads | Seung-Kon Mok, Gu-Sung Kim | 1997-04-15 |
| 5594275 | J-leaded semiconductor package having a plurality of stacked ball grid array packages | Young-Shin Kwon | 1997-01-14 |
| 5552635 | High thermal emissive semiconductor device package | Gu-Sung Kim, Jong Goo Kim, Jae Myung Park | 1996-09-03 |
| 5504373 | Semiconductor memory module | Sang E. Oh, Seung-Kon Mok, Gu-Sung Kim | 1996-04-02 |
| 5351334 | Rotation and alignment device for assembling of optical fiber connector with lower connection loss | Oh-Gone Chun, Myung Yung Jeong, Tae Goo Choy | 1994-09-27 |