Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255047 | Embedded high-z marker material and process for alignment of multilevel ebeam lithography | Christopher David Bohn, Maxwell Choi, Sieu Ha, Maggy Lau, Clayton Jackson +2 more | 2025-03-18 |
| 11823864 | Embedded high-Z marker material and process for alignment of multilevel ebeam lithography | Christopher David Bohn, Maxwell Choi, Sieu Ha, Maggy Lau, Clayton Jackson +2 more | 2023-11-21 |
| 10388454 | Laminated conductors | Florian G. Herrault | 2019-08-20 |
| 10305163 | Method and apparatus for semitransparent antenna and transmission lines | Hyok Jae Song, Hasan Sharifi, Keerti S. Kona, Igal Bilik | 2019-05-28 |
| 10062505 | Laminated conductors | Florian G. Herrault | 2018-08-28 |
| 10032851 | Formation of high-resolution patterns inside deep cavities and applications to RF Si-embedded inductors | Florian G. Herrault | 2018-07-24 |
| 9837372 | Wafer-level die to package and die to die interconnects suspended over integrated heat sinks | Florian G. Herrault, Alexandros Margomenos, Miroslav Micovic | 2017-12-05 |
| 9825116 | Formation of high-resolution patterns inside deep cavities and applications to RF SI-embedded inductors | Florian G. Herrault | 2017-11-21 |
| 9508652 | Direct IC-to-package wafer level packaging with integrated thermal heat spreaders | Florian G. Herrault, Alexandros Margomenos | 2016-11-29 |
| 9385083 | Wafer-level die to package and die to die interconnects suspended over integrated heat sinks | Florian G. Herrault, Alexandros Margomenos, Miroslav Micovic | 2016-07-05 |
| 9337124 | Method of integration of wafer level heat spreaders and backside interconnects on microelectronics wafers | Florian G. Herrault, Alexandros Margomenos, Miroslav Micovic, Eric M. Prophet | 2016-05-10 |
| 7696062 | Method of batch integration of low dielectric substrates with MMICs | Patty Chang-Chien, Chi Kong Cheung, Xianglin ZENG | 2010-04-13 |