Issued Patents All Time
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121731 | Digital radio head control | Ashoke Ravi, Benjamin Jann, Satwik Patnaik, Elan Banin, Igal Kushnir +1 more | 2021-09-14 |
| 10972075 | Active quadrature circuits for high frequency applications | Hsuanyu Pan, Hasan Sharifi, Igal Bilik | 2021-04-06 |
| 10476546 | Transmitter/receiver module for millimeter wave 5G MIMO communication systems | — | 2019-11-12 |
| 10217648 | Fabrication of microfluidic channels in diamond | David F. Brown, Keisuke Shinohara, Miroslav Micovic, Andrea Corrion, Hector L. Bracamontes +1 more | 2019-02-26 |
| 10135483 | Transmitter/receiver module for millimeter wave 5G MIMO communication systems | — | 2018-11-20 |
| 10079160 | Surface mount package for semiconductor devices with embedded heat spreaders | Miroslav Micovic, Eric M. Prophet | 2018-09-18 |
| 9929243 | Stepped field plate wide bandgap field-effect transistor and method | Andrea Corrion, Keisuke Shinohara, Miroslav Micovic, Rongming Chu, David F. Brown +1 more | 2018-03-27 |
| 9866259 | Transmitter/receiver module for millimeter wave 5G MIMO communication systems | — | 2018-01-09 |
| 9837372 | Wafer-level die to package and die to die interconnects suspended over integrated heat sinks | Florian G. Herrault, Melanie S. Yajima, Miroslav Micovic | 2017-12-05 |
| 9780014 | Simultaneous controlled depth hot embossing and active side protection during packaging and assembly of wide bandgap devices | Miroslav Micovic | 2017-10-03 |
| 9584073 | Internally matched active single-to-differential RF converter | Pan Hsuanyu, Hasan Sharifi, Igal Bilik | 2017-02-28 |
| 9553057 | E-plane probe with stepped surface profile for high-frequency | Eric M. Prophet, Miroslav Micovic | 2017-01-24 |
| 9508652 | Direct IC-to-package wafer level packaging with integrated thermal heat spreaders | Florian G. Herrault, Melanie S. Yajima | 2016-11-29 |
| 9496197 | Near junction cooling for GaN devices | Miroslav Micovic, Keisuke Shinohara, Andrea Corrion | 2016-11-15 |
| 9385083 | Wafer-level die to package and die to die interconnects suspended over integrated heat sinks | Florian G. Herrault, Melanie S. Yajima, Miroslav Micovic | 2016-07-05 |
| 9379680 | Systems, methods, and apparatus for a power amplifier module | Miroslav Micovic, Ara K. Kurdoghlian, Ross Bowen | 2016-06-28 |
| 9337124 | Method of integration of wafer level heat spreaders and backside interconnects on microelectronics wafers | Florian G. Herrault, Miroslav Micovic, Melanie S. Yajima, Eric M. Prophet | 2016-05-10 |
| 9331735 | GaN based active cancellation circuit for high power simultaneous transmit and receive systems | Miroslav Micovic, Ara K. Kurdoghlian | 2016-05-03 |
| 9276529 | High performance GaN operational amplifier with wide bandwidth and high dynamic range | David F. Brown, Miroslav Micovic, Ara K. Kurdoghlian | 2016-03-01 |
| 9214404 | Apparatus for mounting microelectronic chips | Miroslav Micovic | 2015-12-15 |
| 9142626 | Stepped field plate wide bandgap field-effect transistor and method | Andrea Corrion, Keisuke Shinohara, Miroslav Micovic, Rongming Chu, David F. Brown +1 more | 2015-09-22 |
| 9093394 | Method and structure for encapsulation and interconnection of transistors | Keisuke Shinohara, Dean C. Regan, Miroslav Micovic, Colleen M. Butler | 2015-07-28 |
| 9059140 | Simultaneous controlled depth hot embossing and active side protection during packaging and assembly of wide bandgap devices | Miroslav Micovic | 2015-06-16 |
| 8786496 | Three-dimensional array antenna on a substrate with enhanced backlobe suppression for mm-wave automotive applications | Amin Rida, Li-Ying Yang, Manos Tentzeris | 2014-07-22 |
| 8617927 | Method of mounting electronic chips | Miroslav Micovic | 2013-12-31 |