Issued Patents All Time
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322714 | Heterogeneous integration of radio frequency transistor chiplets having interconnection tuning circuits | James F. Buckwalter, Michael D. Hodge, Justin Kim, Daniel S. Green | 2025-06-03 |
| 12272475 | Magnetically anisotropic binder-free films containing discrete hexaferrite nanoplatelets | Shanying Cui, Xin N. Guan, Adam F. Gross | 2025-04-08 |
| 12261091 | Chip integration into cavities of a host wafer using lateral dielectric material bonding | Isaac Rivera, Daniel S. Green, James F. Buckwalter | 2025-03-25 |
| 12230659 | Interposer for curved detector | Tobias A. Schaedler, Kevin Geary, Mark O'Masta, Kayleigh A. Porter, Minh B. Nguyen | 2025-02-18 |
| 12218067 | Through-wafer coaxial transition | — | 2025-02-04 |
| 12191295 | Heterogeneous integration of radio frequency transistor chiplets having interconnections to host wafer circuits for optimizing operating conditions | James F. Buckwalter, Justin Kim, Michael D. Hodge, Daniel S. Green | 2025-01-07 |
| 12125759 | Chip integration into cavities of a host wafer using lateral dielectric material bonding | Isaac Rivera, Daniel S. Green, James F. Buckwalter | 2024-10-22 |
| 12099092 | Built in self-test of heterogeneous integrated radio frequency chiplets | James F. Buckwalter, Michael D. Hodge, Justin Kim, Daniel S. Green | 2024-09-24 |
| 11972970 | Singulation process for chiplets | Joel C. Wong | 2024-04-30 |
| 11940495 | Built in self-test of heterogeneous integrated radio frequency chiplets | James F. Buckwalter, Michael D. Hodge, Justin Kim, Daniel S. Green | 2024-03-26 |
| 11810876 | Heterogeneous integration of radio frequency transistor chiplets having interconnection tuning circuits | James F. Buckwalter, Michael D. Hodge, Justin Kim, Daniel S. Green | 2023-11-07 |
| 11769843 | Photonic integrated module with metal embedded chips | Daniel Yap, Christopher S. Roper, Partia Naghibi | 2023-09-26 |
| 11756848 | Chip integration into cavities of a host wafer using lateral dielectric material bonding | Isaac Rivera, Daniel S. Green, James F. Buckwalter | 2023-09-12 |
| 11756783 | Method for creating cavities in silicon carbide and other semiconductor substrates | Eric M. Prophet, Joel C. Wong | 2023-09-12 |
| 11733297 | Built in self-test of heterogeneous integrated radio frequency chiplets | James Buckwaiter, Michael D. Hodge, Justin Kim, Daniel S. Green | 2023-08-22 |
| 11721605 | Wafer-level integrated micro-structured heat spreaders | Chia-Ming Chang | 2023-08-08 |
| 11536800 | Method and apparatus to increase radar range | Jonathan J. Lynch | 2022-12-27 |
| 11527482 | Hybrid integrated circuit architecture | — | 2022-12-13 |
| 11434171 | Low-temperature-deposited self-biased magnetic composite films containing discrete hexaferrite platelets | Xin N. Guan, Shanying Cui | 2022-09-06 |
| 11300754 | Offset patterned micro-lens and micro-optical bench including the same | Pamela R. Patterson, Oleg M. Efimov, Keyvan Sayyah | 2022-04-12 |
| 11295882 | Magnetically anisotropic binder-free films containing discrete hexaferrite nanoplatelets | Shanying Cui, Xin N. Guan, Adam F. Gross | 2022-04-05 |
| 11219919 | Electrostatically driven assembly of nanoparticle materials into dense films | Shanying Cui, Adam F. Gross | 2022-01-11 |
| 11158520 | Method to protect die during metal-embedded chip assembly (MECA) process | — | 2021-10-26 |
| 11029387 | Radar system with frequency conversion and corresponding method | Hasan Sharifi, Robert G. Nagele, Igal Bilik | 2021-06-08 |
| 10998273 | Hybrid integrated circuit architecture | David F. Brown, Hasan Sharifi, Joel C. Wong, Dean C. Regan, Yan Tang +1 more | 2021-05-04 |