Issued Patents All Time
Showing 26–41 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10957537 | Methods to design and uniformly co-fabricate small vias and large cavities through a substrate | — | 2021-03-23 |
| 10950562 | Impedance-matched through-wafer transition using integrated heat-spreader technology | Eric M. Prophet | 2021-03-16 |
| 10847857 | Method and apparatus for integrated shielded circulator | Jonathan J. Lynch | 2020-11-24 |
| 10829386 | Methods for making hydrothermally crystallized water-dispersible hexaferrite platelets | Adam F. Gross, Xin N. Guan, Shanying Cui | 2020-11-10 |
| 10600739 | Interposer with interconnects and methods of manufacturing the same | Zak C. Eckel, Tobias A. Schaedler, Robert Mone | 2020-03-24 |
| 10483184 | Recursive metal embedded chip assembly | Miroslav Micovic | 2019-11-19 |
| 10388454 | Laminated conductors | Melanie S. Yajima | 2019-08-20 |
| 10062505 | Laminated conductors | Melanie S. Yajima | 2018-08-28 |
| 10032851 | Formation of high-resolution patterns inside deep cavities and applications to RF Si-embedded inductors | Melanie S. Yajima | 2018-07-24 |
| 10026672 | Recursive metal embedded chip assembly | Miroslav Micovic | 2018-07-17 |
| 9842814 | Integrated RF subsystem | Miroslav Micovic | 2017-12-12 |
| 9837372 | Wafer-level die to package and die to die interconnects suspended over integrated heat sinks | Melanie S. Yajima, Alexandros Margomenos, Miroslav Micovic | 2017-12-05 |
| 9825116 | Formation of high-resolution patterns inside deep cavities and applications to RF SI-embedded inductors | Melanie S. Yajima | 2017-11-21 |
| 9508652 | Direct IC-to-package wafer level packaging with integrated thermal heat spreaders | Melanie S. Yajima, Alexandros Margomenos | 2016-11-29 |
| 9385083 | Wafer-level die to package and die to die interconnects suspended over integrated heat sinks | Melanie S. Yajima, Alexandros Margomenos, Miroslav Micovic | 2016-07-05 |
| 9337124 | Method of integration of wafer level heat spreaders and backside interconnects on microelectronics wafers | Alexandros Margomenos, Miroslav Micovic, Melanie S. Yajima, Eric M. Prophet | 2016-05-10 |